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Product Detailed Parameters
- Description：IC LED DRIVER 36HVQFN
- Series：-
- Mfr：NXP USA Inc.
- Package：Tape & Reel (TR)
- Type：-
- Topology：-
- Internal Switch(s)：-
- Number of Outputs：-
- Voltage - Supply (Min)：-
- Voltage - Supply (Max)：-
- Voltage - Output：-
- Current - Output / Channel：-
- Frequency：-
- Dimming：-
- Applications：-
- Operating Temperature：-
- Mounting Type：Surface Mount, Wettable Flank
- Package / Case：36-VFQFN Exposed Pad
- Supplier Device Package：36-HVQFN (6x6)
- Grade：-
- Qualification：-
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Overview
The ASL9015SHNZ is an LED driver integrated circuit manufactured by NXP USA Inc. It is housed in a 36-HVQFN (6x6) package with an exposed pad for thermal management. The device supports output dimming capabilities and is designed for surface-mount applications. It complies with European Union environmental standards, having passed ROHS certification and the REACH directive.
Feature Summary
- Integrated LED driver functionality with output dimming support
- Compact 36-HVQFN package design optimized for PCB space efficiency
- Compliant with EU environmental standards including ROHS and REACH directives
Applications
- General LED lighting systems requiring compact driver solutions
- Applications prioritizing PCB space optimization
- Environmentally regulated electronic assemblies
Procurement Notes
Verify component authenticity through authorized NXP distributors or certified suppliers. Confirm that the received units match the exact part number ASL9015SHNZ and packaging type. Check for valid ROHS and REACH compliance documentation as specified by the manufacturer. Ensure storage conditions adhere to the moisture sensitivity level requirements to prevent damage before soldering.
Selection Notes
Select this component when a compact LED driver with dimming capability is required for space-constrained designs. The 36-HVQFN package suits high-density PCB layouts. Consider its compliance with EU environmental regulations if targeting markets with strict RoHS and REACH mandates. Evaluate thermal performance needs relative to the exposed pad design for adequate heat dissipation in the final application.
Part Context
This part belongs to NXP's portfolio of power management and LED driver integrated circuits. It utilizes advanced semiconductor technology to provide efficient LED control within a small footprint. The HVQFN package variant offers improved thermal characteristics compared to standard QFN packages, supporting reliable operation in various lighting applications.
Replacement Considerations
No public confirmed substitute part numbers are available for this specific model. Consult NXP technical support for potential alternatives if this discontinued or obsolete item requires replacement in existing designs.
