ATSAMD21J17D-MF

Overview

The ATSAMD21J17D-MF is a 32-bit microcontroller based on the ARM Cortex-M0+ core, operating at a maximum frequency of 48MHz. It features 128KB of Flash memory and 16KB of SRAM. The device supports a supply voltage range of 1.62V to 3.63V and includes 52 I/O pins. Connectivity options include I2C, LINbus, SPI, UART/USART, and USB peripherals. Data conversion capabilities consist of twenty 12-bit ADC channels and one 10-bit DAC. The component is housed in a 64-QFN (9x9) package and is rated for an operating temperature range of -40°C to 125°C.

Feature Summary

• AEC-Q100 qualified for automotive functional safety applications
• Integrated full-speed USB device and embedded host controller
• Supports up to 60 touch sensing channels
• Includes DMA, I2S, PWM, and watchdog timer peripherals

Applications

• Automotive infotainment systems
• Industrial control units
• Smart home automation devices
• Portable metering equipment

Procurement Notes

Verify the specific suffix against official Microchip documentation to confirm package type and temperature grade. Confirm AEC-Q100 qualification status for automotive use cases. Check current datasheet revisions for any errata or specification updates prior to final design integration.

Selection Notes

Select this model when automotive-grade reliability and functional safety compliance are required. Ensure the 64-QFN footprint matches the PCB layout constraints. Verify that the 128KB Flash capacity meets application code storage needs alongside the 16KB RAM limit for runtime data.

Part Context

This part belongs to the SAM D21J series within the Microchip SAM D21 family. It shares architectural similarities with other SAM D21 variants but is distinguished by its automotive qualification and specific memory configuration. The series targets low-power, high-performance embedded control applications requiring robust connectivity.

Replacement Considerations

Consult official substitution lists for equivalent parts with matching pinouts and specifications. Verify compatibility regarding package dimensions and thermal characteristics before transitioning designs.