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ATSAMS70Q19B-AN
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Product Detailed Parameters
- Description：IC MCU 32BIT 512KB FLASH 144LQFP
- Series：SAM S70
- Mfr：Microchip Technology
- Package：Tray
- Core Processor：ARM® Cortex®-M7
- Core Size：32-Bit Single-Core
- Speed：300MHz
- Connectivity：EBI/EMI, I2C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SPI, UART/USART, USB
- Peripherals：Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
- Number of I/O：114
- Program Memory Size：512KB (512K x 8)
- Program Memory Type：FLASH
- EEPROM Size：-
- RAM Size：256K x 8
- Voltage - Supply (Vcc/Vdd)：1.7V ~ 3.6V
- Data Converters：A/D 24x12b; D/A 2x12b
- Oscillator Type：Internal
- Operating Temperature：-40°C ~ 105°C (TA)
- Mounting Type：Surface Mount
- Supplier Device Package：144-LQFP (20x20)
- Package / Case：144-LQFP
- Grade：-
- Qualification：-
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Overview
The ATSAMS70Q19B-AN is a 32-bit microcontroller from the SAM S70 series, featuring an ARM Cortex-M7 core operating at 300MHz. It integrates 512KB of flash memory and 256KB of SRAM. The device supports a supply voltage range of 1.7V to 3.6V and includes multiple communication interfaces such as USB, SPI, I2C, UART, and Ethernet. It offers 114 I/O pins and is housed in a 144-LFBGA package.
Feature Summary
- Integrates an ARM Cortex-M7 processor with DSP and FPU capabilities for high-performance computing.
- Includes an integrated Ethernet MAC with AVB support for reliable network connectivity.
- Features multiple high-speed serial communication peripherals including USB OTG and QSPI.
- Provides extensive analog conversion options with multiple 12-bit ADC channels.
Applications
- Industrial automation controllers requiring robust processing power
- Human-machine interface (HMI) panels with display drivers
- Networked IoT gateways utilizing Ethernet connectivity
- Automotive infotainment systems
Procurement Notes
Verify the specific suffix 'AN' against the manufacturer's official datasheet to confirm pinout and package dimensions. Ensure compatibility with existing PCB footprints for the 144-LFBGA configuration. Check for moisture sensitivity level requirements during storage and handling. Confirm that the selected development tools support the SAM S70 family architecture.
Selection Notes
Select this component when high computational throughput and integrated networking are required. Compare pin counts and peripheral availability against alternative packages in the SAM S70 series. Evaluate thermal performance requirements for the LFBGA package in enclosed environments. Consider the availability of software libraries for the Ethernet and USB stacks provided by the manufacturer.
Part Context
This part belongs to the SAM S70 family, designed for applications demanding high performance and rich connectivity. It shares architectural similarities with the SAM E70 and SAM V70 series but may differ in specific peripheral configurations and package options. The family targets industrial, automotive, and consumer electronics markets.
Replacement Considerations
Consult the official SAM S70 product selector guide for verified pin-to-pin or functional equivalents within the same family. Cross-reference datasheets to ensure identical memory sizes and peripheral sets before substitution.
