ATXMEGA64D3-MH

ATXMEGA64D3-MH

$4.53
  • Description:IC MCU 8/16BIT 64KB FLASH 64QFN
  • Series:AVR® XMEGA® D3
  • Mfr:Microchip Technology
  • Package:Tray
  • Core Processor:AVR

SKU:1ea96f21e57c Category: Brand:

  
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Product Detailed Parameters

  • Description:IC MCU 8/16BIT 64KB FLASH 64QFN
  • Series:AVR® XMEGA® D3
  • Mfr:Microchip Technology
  • Package:Tray
  • Core Processor:AVR
  • Core Size:8/16-Bit
  • Speed:32MHz
  • Connectivity:I2C, IrDA, SPI, UART/USART
  • Peripherals:Brown-out Detect/Reset, POR, PWM, WDT
  • Number of I/O:50
  • Program Memory Size:64KB (32K x 16)
  • Program Memory Type:FLASH
  • EEPROM Size:2K x 8
  • RAM Size:4K x 8
  • Voltage - Supply (Vcc/Vdd):1.6V ~ 3.6V
  • Data Converters:A/D 16x12b
  • Oscillator Type:Internal
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Supplier Device Package:64-QFN (9x9)
  • Package / Case:64-VFQFN Exposed Pad
  • Grade:-
  • Qualification:-

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ATXMEGA64D3-MH

Overview

The ATXMEGA64D3-MH is an 8-bit AVR XMEGA D3 microcontroller featuring a 64 kB Flash program memory, 2 kB EEPROM, and 4 kB SRAM. It operates within a supply voltage range of 1.6 V to 3.6 V and supports a maximum clock frequency of 32 MHz. The device utilizes a 64-pin QFN package with 50 available I/O lines. Key peripherals include a 12-bit ADC, five timers/counters, and interfaces such as SPI, TWI, and USART. Operating temperatures range from -40°C to +85°C.

Feature Summary

  • Integrates high-performance 8-bit AVR RISC core with up to 32 MIPS throughput.
  • Features event system for direct peripheral-to-peripheral communication without CPU intervention.
  • Includes DMA controller to offload data transfers and reduce processor load.
  • Supports low-power operation with multiple sleep modes and fast wake-up capabilities.

Applications

  • Battery-powered consumer devices requiring extended operational life
  • Industrial control systems with sensor interface requirements
  • Smart metering applications involving utility monitoring
  • Building automation and climate control units

Procurement Notes

Verify the specific suffix MH indicates the QFN-64 package configuration during sourcing. Confirm RoHS compliance status through official Microchip documentation prior to integration. Ensure ESD handling protocols are followed due to moisture sensitivity classification. Cross-reference datasheet revisions to confirm pinout consistency for PCB layout finalization.

Selection Notes

Select this component when a balance of moderate memory capacity and extensive I/O count is required in a compact surface-mount form factor. The D3 series offers enhanced analog performance compared to older B series variants. Evaluate power consumption profiles against application duty cycles to leverage picoPower technology benefits effectively.

Part Context

This MCU belongs to the AVR XMEGA D3 family, designed for applications demanding efficient power management alongside robust processing capabilities. The D3 series distinguishes itself with improved timer configurations and additional analog features compared to previous generations. It targets markets where size constraints and energy efficiency are critical design parameters.

Replacement Considerations

ATXMEGA64D3-AU serves as a pin-compatible alternative in TQFP-64 packaging. ATXMEGA64D3-AUR provides the same functionality in tape-and-reel format for automated assembly processes. Verify package dimensions and thermal characteristics when substituting between QFN and TQFP variants.

ATXMEGA64D3-MHATXMEGA64D3-MH
$4.53
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