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Product Detailed Parameters
- Description：IC TELECOM INTERFACE 24HSOP
- Series：-
- Mfr：Rohm Semiconductor
- Package：Tape & Reel (TR),Cut Tape (CT)
- Function：Speech Network IC
- Interface：-
- Number of Circuits：1
- Voltage - Supply：1.15V ~ 1.27V
- Current - Supply：-
- Operating Temperature：-35°C ~ 60°C
- Mounting Type：Surface Mount
- Package / Case：24-SOP (0.213", 5.40mm Width) + 2 Heat Tabs
- Supplier Device Package：24-HSOP
- Power (Watts)：1.35 W
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Overview
The BA6566FP-E2 is a speech network integrated circuit designed for handset communications. It amplifies transmitter signals to the telephone line and drives the receiver with reception signals. The device incorporates automatic gain control (AGC) based on line current to compensate for volume fluctuations caused by line length. It accommodates both dynamic and piezoelectric receivers via circuit constant adjustments. The component utilizes an HSOP-24 package, eliminating the need for external heat-dissipating transistors while maintaining compatibility with common DIP-based circuits.
Feature Summary
- Supports both dynamic and piezoelectric receivers through adjustable circuit constants for wide dynamic range
- Integrates automatic gain control based on transmission and reception line current
- Minimizes erroneous operation from high-frequency electrical wave interference
- Utilizes HSOP package design to eliminate the requirement for attached heat-dissipating transistors
Applications
- Telephones
- Telephone equipment
Procurement Notes
Verify the specific ordering suffix against official documentation to confirm compliance details and packaging variations. Ensure the component matches the required pin configuration and thermal characteristics for the target application. Cross-reference the manufacturer's latest datasheet to validate active status and environmental certifications before finalizing procurement decisions.
Selection Notes
Select this component for applications requiring integrated speech network functions in telephony systems. Consider the HSOP package benefits for space-constrained designs that previously required discrete heat sinks. Evaluate the AGC performance relative to specific telephone line standards and ensure the receiver type aligns with the available circuit adjustment options.
Part Context
The BA6566FP-E2 belongs to the BA6566 family of speech network ICs manufactured by ROHM Semiconductor. This series provides essential handset communication functions, including signal amplification and automatic gain control. The FP variant specifically denotes the HSOP package form factor, which offers thermal management advantages over standard DIP packages without requiring additional external components.
Replacement Considerations
BA6566FP
FAQ
How does the BA6566FP-E2 handle volume fluctuations?
It uses automatic gain control based on transmission and reception telephone line current to compensate for volume changes caused by line length.
What types of receivers can the BA6566FP-E2 drive?
It can accommodate both dynamic and piezoelectric receivers by changing the circuit constants.
Does the BA6566FP-E2 require an external transistor for heat dissipation?
No, the HSOP package eliminates the need for an attached transistor to dissipate heat.
