BAP64LX,315

RF Diode Overview

The BAP64LX,315 is a silicon PIN diode manufactured by NXP USA Inc., designed for radio frequency applications. It features a single-diode configuration housed in an SOD-882 (SOD2) surface-mount package. Key electrical specifications include a maximum peak reverse voltage of 60V and a maximum forward current of 100 mA. The device exhibits a capacitance of 0.3 pF at 20V and 1 MHz, with a resistance of 1.5 ohms at 100 mA and 100 MHz. Maximum power dissipation is rated at 150 mW, and the junction temperature range spans from -65°C to 150°C. This component is classified as end-of-life.

RF Diode Feature Summary

• Single RF PIN diode structure optimized for high-frequency signal control
• Low capacitance characteristic suitable for minimal signal distortion in RF paths
• Compact SOD-882 surface-mount packaging for automated assembly integration

RF Diode Applications

• RF switching circuits in wireless communication modules
• Attenuator networks in sub-GHz ISM band devices
• Phase shifting elements in antenna tuning systems

RF Diode Procurement Notes

This component is officially designated as End of Life by NXP USA Inc. Verification of availability should focus on surplus distributors or secondary market sources rather than direct manufacturer allocation. Buyers must confirm lot dates and storage conditions due to the discontinued status. Regulatory compliance data indicates RoHS 3 conformity for this specific suffix version.

RF Diode Selection Notes

Designers replacing this part should verify that substitute components match the 60V reverse voltage rating and 0.3 pF capacitance specification at 1 MHz. The SOD-882 footprint requires compatible land pattern design. Consider thermal management constraints given the 150 mW power dissipation limit and the -65°C to 150°C operating range when integrating into dense PCB layouts.

RF Diode Part Context

The BAP64LX,315 belongs to the broader BAP64 family of RF PIN diodes from NXP. While other variants like the BAP64Q offer dual-diode configurations in TSOP packages, the LX variant provides a single-diode solution in a smaller DFN1006D-2/SOD-882 form factor. This specific suffix denotes tape-and-reel packaging compliant with RoHS 3 standards.

RF Diode Replacement Considerations

Publicly confirmed substitutes are not explicitly listed in the provided documentation. Designers should evaluate generic RF PIN diodes with matching 60V VR, <0.3 pF C, and SOD-882 compatibility. Verify pinout alignment and thermal characteristics before implementation.