BAS521-HF

Single Diodes Overview

The BAS521-HF is a small signal switching diode manufactured by Comchip Technology, designed for surface-mount applications. It features a single configuration housed in an SOD-523-2 package. The device supports a peak reverse voltage of 300 V and a maximum forward current of 250 mA. Key electrical characteristics include a recovery time of 16 ns, a forward voltage of 950 mV, and a reverse current of 30 nA. It operates within a temperature range of -65 °C to +150 °C and can withstand a maximum surge current of 4.5 A.

Single Diodes Feature Summary

• High-speed switching capability with a 16 ns recovery time
• Robust reverse voltage handling up to 300 V
• Compact SMD form factor suitable for automated assembly

Single Diodes Applications

• General-purpose signal rectification
• High-frequency switching circuits
• Protection against reverse polarity

Single Diodes Procurement Notes

Verify the specific datasheet version and RoHS compliance status directly with Comchip Technology or authorized distributors before procurement. Confirm that the SOD-523-2 package dimensions match your PCB footprint requirements. Ensure the operating temperature range aligns with your system's environmental conditions. Check for any specific ordering suffixes that may indicate different binning or packaging options.

Single Diodes Selection Notes

Select this component when a compact, high-voltage switching diode is required for space-constrained designs. The 300 V rating provides significant headroom for general signal processing tasks. Consider the 16 ns recovery time for applications requiring fast switching speeds. The wide operating temperature range makes it suitable for industrial environments where thermal stability is critical.

Single Diodes Part Context

This part belongs to Comchip Technology's line of small signal switching diodes. It is designed as a surface-mount alternative to through-hole counterparts, offering similar electrical performance in a smaller footprint. The SOD-523-2 package allows for higher density on printed circuit boards compared to larger packages.