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The BAT54C-BO-E3-18 is a dual Schottky barrier diode array manufactured by Vishay General Semiconductor - Diodes Division. It features a common cathode configuration housed in an SOT-23 surface-mount package. The device is rated for a maximum repetitive peak reverse voltage of 30 V and a continuous forward current of 200 mA. Constructed with low-loss silicon, it ensures negligible switching losses and extremely fast switching speeds. The component complies with RoHS standards and utilizes the ECOPACK 2 compliant packaging format.
Verify the specific suffix 'BO' against official Vishay documentation to confirm package variant accuracy, as standard listings often reference 'E3'. Ensure the selected distributor provides traceable components from authorized channels. Cross-reference the datasheet revision date to confirm compliance with current environmental regulations and material specifications before finalizing procurement orders.
Select this component for designs requiring high-speed rectification with minimal reverse recovery charge. The common cathode arrangement allows for efficient use of two diodes in a single compact footprint. Consider the 30 V reverse voltage rating and 200 mA forward current limits when designing circuit protection or signal processing stages to ensure reliable operation under expected load conditions.
This part belongs to the BAT54 series of general-purpose Schottky diodes. The series is characterized by low forward voltage drop and fast switching capabilities, making it suitable for various consumer electronics and industrial applications. The E3 suffix indicates lead-free and halogen-free compliance, aligning with modern environmental manufacturing standards for semiconductor components.
BAT54C-E3-18 is a direct equivalent offering identical electrical characteristics and pinout compatibility. BAT54SC-E3-18 provides similar functionality in a different surface-mount package variant. Verify pin configuration and thermal performance requirements when substituting with these alternatives to ensure seamless integration into existing PCB layouts.