BAV70T,115

Overview

The BAV70T,115 is a small signal switching diode manufactured by NXP USA Inc. It features a dual common cathode configuration housed in an SOT-323 (SC-70) surface-mount package. The device is rated for a peak reverse voltage of 100 V and supports a maximum forward current of 175 mA. Key electrical characteristics include a fast recovery time of 4 ns and a low reverse leakage current of 500 nA. It operates within a temperature range of -65°C to +150°C and complies with RoHS3 standards.

Feature Summary

• Dual common cathode configuration for efficient circuit design
• Fast switching capability with 4 ns recovery time
• High thermal stability operating up to 150°C
• Compact SOT-323 surface-mount packaging

Applications

• General purpose signal switching
• Protection circuits in consumer electronics
• Logic level shifting applications

Procurement Notes

Verify the specific suffix '115' corresponds to the tape and reel packaging format required for automated assembly processes. Confirm that the component meets the necessary environmental compliance standards for the target region. Ensure compatibility with standard reflow soldering profiles specified for the SOT-323 package type during manufacturing integration.

Selection Notes

Select this component when a compact dual diode solution is required for high-speed switching tasks. The SOT-323 package offers space savings compared to larger through-hole alternatives. Consider the 100 V reverse voltage rating for moderate voltage protection scenarios where low capacitance and fast response are critical performance factors.

Part Context

This part belongs to the BAV70 series of small signal switching diodes produced by Nexperia and distributed by NXP. These components are widely used in digital logic circuits and signal processing paths due to their reliable switching characteristics and standardized footprint compatibility across various electronic designs.

Replacement Considerations

Compatible substitutes include the BAV70W,115 which utilizes the same functional architecture but may differ in specific packaging dimensions or handling requirements. Verify pinout compatibility and thermal dissipation capabilities before implementing any alternative component in existing designs.