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BC546B-AP is listed in the Single Bipolar Transistors range at ChipApex. The manufacturer field lists MCC (Micro Commercial Components). Its product description is TRANS NPN 65V 0.1A TO-92. Review the specifications below when checking this part for your BOM.
The BC546B-AP is an NPN silicon small signal bipolar junction transistor manufactured by Micro Commercial Components. It features a maximum collector current of 100mA and a collector-emitter breakdown voltage of 65V. The device has a minimum DC current gain (hFE) of 200 at 2mA base current and 5V collector voltage. It operates with a maximum power dissipation of 625mW and a transition frequency of 300MHz. The component is housed in a TO-92 plastic package with through-hole mounting and supports a junction temperature range from -55°C to 150°C.
Verify the specific manufacturer lot and date code upon receipt, as supply sources may vary. Confirm that the received components match the BC546B-AP designation exactly, ensuring the suffix indicates RoHS compliance. Check for physical integrity of the TO-92 package leads before soldering. Ensure storage conditions prevent moisture absorption prior to use.
Select this component when a standard NPN transistor with moderate voltage handling and high current gain is required. The TO-92 package suits prototyping and low-volume through-hole designs. Consider the 65V rating for low-voltage logic interfacing. Verify thermal management requirements against the 625mW dissipation limit in enclosed environments.
This part belongs to the BC546 series of NPN transistors produced by Micro Commercial Components. It is functionally similar to other industry-standard equivalents but carries MCC-specific manufacturing attributes. The 'AP' suffix typically denotes lead-free packaging and RoHS compliance within the manufacturer's lineup. It serves as a direct replacement for generic BC546B devices in many legacy designs.
Direct substitutes include BC546B parts from other manufacturers such as ON Semiconductor or Fairchild, provided pinouts and electrical ratings align. Verify that alternative packages maintain the same thermal characteristics. Ensure any cross-brand replacement meets the same hFE binning requirements for circuit stability.
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