BC636-10-BP

Single Bipolar Transistors Overview

The BC636-10-BP is a PNP epitaxial silicon transistor manufactured by Micro Commercial Components (MCC). It features a TO-92 through-hole package with a maximum collector current of -1.0 A and power dissipation of 830 mW. The device offers a collector-emitter breakdown voltage of -45 V. DC current gain ranges from 63 to 160 at an IC of -150 mA, ensuring reliable switching performance.

Single Bipolar Transistors Feature Summary

• PNP epitaxial silicon construction for robust switching applications
• Through-hole TO-92 package design for standard mounting
• High DC current gain optimized for low-current drive requirements

Single Bipolar Transistors Applications

• General-purpose switching circuits
• Amplifier stages requiring PNP polarity
• Logic interface buffering

Single Bipolar Transistors Procurement Notes

Verify the specific suffix against official MCC documentation to confirm electrical tolerances. Ensure procurement channels are authorized distributors to guarantee component authenticity and traceability. Confirm RoHS compliance status via the manufacturer's latest datasheet revision before finalizing orders.

Single Bipolar Transistors Selection Notes

Select this component when a PNP transistor with -45V VCEO and -1.0A IC rating is required in a TO-92 package. The BC636-10 variant provides a lower hFE range compared to other BC636 grades. Verify thermal management capabilities align with the 830mW dissipation limit under operating conditions.

Single Bipolar Transistors Part Context

This part belongs to the BC636 series of PNP transistors produced by Micro Commercial Components. The series includes variants with different breakdown voltages and gain ranges. The BC636-10 specifically denotes a standardized gain bin within the -45V collector-emitter voltage family.

Single Bipolar Transistors Replacement Considerations

Compatible substitutes include the BC636-16 or BC638 if higher gain or voltage ratings are acceptable. Verify pinout compatibility and thermal characteristics match the original design constraints before substitution.