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The Nexperia BC817-40QBH-QZ is an NPN general-purpose transistor housed in a DFN1110D-3 (SOT8015) leadless SMD package with side-wettable flanks. It supports a collector-emitter voltage of 45 V and a continuous collector current of 500 mA, with a peak pulse current of 1 A. The device offers a DC current gain range of 250 to 600 at IC = 100 mA. It features high power dissipation capability, low package height of 0.5 mm, and is qualified according to AEC-Q101 for automotive applications.
Verify the specific ordering suffix matches the required tape-and-reel quantity and packaging format. Confirm that the DFN1110D-3 footprint aligns with your PCB design guidelines. Ensure compliance with RoHS directives and check for any regional export control restrictions applicable to this semiconductor component before finalizing procurement orders.
Select this component when space constraints require an ultra-thin surface-mount package. The BC817-40QBH-QZ provides higher current gain than lower-grade variants, making it suitable for precise amplification tasks. Consider its AEC-Q101 qualification if designing for automotive environments requiring high reliability and temperature resilience up to 175 °C junction temperature.
This part belongs to the Nexperia BC817QBH-Q series, which includes complementary PNP transistors like the BC807-40QBH-QZ. The series utilizes the DFN1110D-3 package to minimize board area while maintaining robust electrical performance. It serves as a modern replacement for traditional SOT-23 packaged transistors in compact consumer and industrial electronics.
Direct pin-compatible replacements within the same series include BC817-16QBH-QZ and BC817-25QBH-QZ, differing primarily in DC current gain ranges. For broader compatibility, verify electrical parameters against standard SOT-23 NPN transistors, ensuring voltage and current ratings meet or exceed original design requirements.
The marking code for the BC817-40QBH-QZ is G3.
Yes, the device is qualified according to AEC-Q101 and supports high-temperature applications up to a junction temperature of 175 °C.
The package features side-wettable flanks, which allow for Automatic Optical Inspection (AOI) of the solder joints to ensure connection integrity.