BC817DPN,125

Overview

The BC817DPN,125 is a dual bipolar junction transistor array manufactured by Nexperia USA Inc. It integrates one NPN and one PNP general-purpose transistor within a compact SC-74 (SOT-457) surface-mount package. The device supports a maximum continuous collector current of 500 mA and withstands a collector-emitter voltage of 45 V. Key electrical specifications include a minimum DC current gain (hFE) of 160 at 100 mA with 1 V collector-emitter voltage, and a transition frequency of 100 MHz for the NPN section. The component is rated for a maximum power dissipation of 600 mW and operates within a temperature range up to 150°C.

Feature Summary

• Dual configuration combining complementary NPN and PNP transistors in a single package
• High current capability suitable for switching and amplification tasks
• Space-efficient surface-mount design optimized for automated optical inspection

Applications

• General-purpose signal switching circuits
• Low-power amplification stages
• Logic interface and level shifting applications

Procurement Notes

Verify the specific suffix against official Nexperia documentation to confirm packaging format and binning requirements. Ensure compatibility with standard SC-74 footprint layouts during procurement planning. Cross-reference manufacturer part numbers with distributor listings to confirm authenticity and traceability before finalizing orders.

Selection Notes

Select this component when space constraints require dual complementary transistors in a minimal footprint. Verify that the 45 V voltage rating and 500 mA current limit meet circuit demands. Consider the 600 mW power dissipation capability relative to thermal management strategies in the target application environment.

Part Context

This part belongs to the BC817 series of general-purpose NPN/PNP transistor arrays. It serves as a compact alternative to discrete dual-transistor solutions, facilitating simplified PCB layout. The SC-74 package provides a standardized interface compatible with common surface-mount assembly processes used in consumer and industrial electronics manufacturing.

Replacement Considerations

BC817DPN,115