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The BC857CWH6327XTSA1 is a dual PNP bipolar junction transistor (BJT) manufactured by Infineon Technologies. It utilizes silicon technology and is housed in an SOT-363-6 surface-mount package. The device features a maximum DC collector current of 100 mA and a collector-emitter voltage (VCEO) of 45 V. Key electrical parameters include a collector-base voltage (VCBO) of 50 V, an emitter-base voltage (VEBO) of 5 V, and a power dissipation (Pd) of 250 mW. The component offers a gain-bandwidth product (fT) of 250 MHz and operates within a temperature range of -65°C to +150°C.
Verify the specific suffix 'C' indicates the required DC current gain (hFE) binning, as this affects amplification characteristics. Confirm the 'H6327XTSA1' suffix corresponds to the correct tape-and-reel packaging format for automated assembly. Ensure the source document explicitly lists this exact part number to avoid confusion with single-transistor variants or other gain bins within the BC857 family.
Select this component when a dual PNP transistor is required in an SOT-363 package to save board space. The 45 V VCEO rating suits low-voltage signal processing tasks. Verify that the 100 mA continuous collector current meets the load requirements. The AEC-Q100 qualification makes it suitable for automotive environments where reliability under thermal stress is critical.
This part belongs to the BC857 series of general-purpose PNP transistors from Infineon. While the base BC857 model exists, the 'C' suffix typically denotes a specific hFE range, and the 'WH6327XTSA1' suffix defines the packaging and reel specifications. It serves as a complementary device to NPN counterparts like the BC847 series in push-pull or differential amplifier configurations.
The primary difference lies in the DC current gain (hFE) ranges. The 'C' suffix typically specifies a higher minimum gain compared to the 'B' suffix, which is crucial for designing high-gain amplifier stages.
Yes, the datasheet indicates AEC-Q100 qualification, confirming its suitability for automotive electronic applications requiring robust performance under varying environmental conditions.