BCM3384DCSA01

BCM3384DCSA01

  • Description:24X8 DOCSIS 3.0 MODEM 3384D
  • Series:*

SKU:7c2e7dbb3b91 Category: Brand:

ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:24X8 DOCSIS 3.0 MODEM 3384D
  • Series:*
  • Mfr:Broadcom Limited
  • Package:Tray
  • Architecture:-
  • Core Processor:-
  • Flash Size:-
  • RAM Size:-
  • Peripherals:-
  • Connectivity:-
  • Speed:-
  • Primary Attributes:-
  • Operating Temperature:-
  • Grade:-
  • Qualification:-
  • Package / Case:-
  • Supplier Device Package:-

Download product information

BCM3384DCSA01

Overview

The BCM3384DCSA01 is a fourth-generation DOCSIS 3.0 System-on-a-Chip (SoC) manufactured by Broadcom Limited. It is designed for cable modem applications, supporting up to 24x8 DOCSIS channel bonding. The component enables downstream data speeds of 1 Gb/s. It integrates the necessary processing and connectivity functions required for high-performance residential access points and gateway devices within broadband networks.

Feature Summary

  • Supports fourth-generation DOCSIS 3.0 protocol standards
  • Enables high-speed downstream data transmission via channel bonding
  • Integrates system-on-chip architecture for compact design

Applications

  • Residential cable modems
  • Gateway devices for broadband access
  • High-speed internet terminal equipment

Procurement Notes

Verify the specific ordering suffix against official Broadcom documentation to ensure correct package type and temperature range. Confirm that the requested part number matches the exact silicon revision required for your design. Request manufacturer datasheets and application notes directly from authorized channels to validate technical specifications before integration.

Selection Notes

Select this SoC when designing systems requiring DOCSIS 3.0 compliance with high downstream throughput. Consider the integrated nature of the chip for reducing board space and component count. Evaluate thermal management requirements associated with high-speed signal processing in enclosed residential environments.

Part Context

This component belongs to Broadcom's portfolio of semiconductor solutions for infrastructure and connectivity. It represents an evolution in cable modem technology, focusing on increased bandwidth capabilities through advanced channel bonding techniques while maintaining compatibility with existing DOCSIS network infrastructures.

Replacement Considerations

Consult official Broadcom substitution guides for compatible alternatives. Verify pinout and software compatibility if considering cross-model replacements within the same product family.

BCM3384DCSA01BCM3384DCSA01

Click on the inquiry