BCM53158XUB0KFBG

BCM53158XUB0KFBG

  • Description:IC ETHERNET SWITCH I2C/SPI
  • Series:RoboSwitch™

SKU:a1723496d657 Category: Brand:

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Product Detailed Parameters

  • Description:IC ETHERNET SWITCH I2C/SPI
  • Series:RoboSwitch™
  • Mfr:Broadcom Limited
  • Package:Tray
  • Protocol:Ethernet
  • Function:Switch
  • Interface:I2C, SPI
  • Standards:IEEE 802.3, 10/100/1000 Base-T/TX PHY
  • Voltage - Supply:-
  • Current - Supply:-
  • Operating Temperature:0°C ~ 70°C
  • Package / Case:-
  • Supplier Device Package:-
  • Grade:-
  • Qualification:-

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BCM53158XUB0KFBG

Overview

The BCM53158XUB0KFBG is an Ethernet switch IC from the Broadcom RoboSwitch family, designed for high-density networking applications. It integrates eight Gigabit Ethernet ports with integrated PHYs and one Quad Small Form-factor Pluggable Gigabit Media Independent Interface (QSGMII) port for uplink connectivity. The device supports data rates of 10/100/1000 Mbps on copper ports and 1 Gbps on the QSGMII interface. It operates within a commercial temperature range of 0°C to +70°C and utilizes a 311-ball FBGA package.

Feature Summary

  • Integrates eight Gigabit Ethernet ports with built-in PHY transceivers for simplified board design.
  • Includes a dedicated QSGMII interface to support four independent 1 Gbps uplinks or external PHY connections.
  • Supports comprehensive Layer 2 switching features including VLAN tagging, QoS prioritization, and link aggregation.

Applications

  • High-port-count enterprise access switches
  • Industrial Ethernet gateways requiring multiple copper and fiber interfaces
  • Telecom base station backhaul equipment

Procurement Notes

Verify the specific suffix 'XUB0' against the official Broadcom datasheet to confirm pinout compatibility and electrical characteristics. Ensure the component meets RoHS directives and humidity sensitivity level requirements for your assembly process. Cross-reference the manufacturer part number with authorized distributors to avoid counterfeit components.

Selection Notes

Select this model when a solution combining multiple integrated copper ports with flexible high-speed uplink options is required. Compare against the BCM53158XMB1KFBG variant if XFI interfaces are preferred over QSGMII. Consider thermal dissipation requirements for the FBGA package in enclosed industrial enclosures.

Part Context

This component belongs to the Broadcom BCM5315x series of RoboSwitch devices, which are optimized for cost-effective, high-performance switching. The series targets providers needing scalable Layer 2 functionality without complex external controller dependencies. It serves as a core switching engine for multi-port infrastructure hardware.

Replacement Considerations

The BCM53158XMB1KFBG is a related variant within the same family but utilizes XFI interfaces instead of QSGMII. Verify interface compatibility before substitution. No other direct public substitutes are confirmed for this specific pinout configuration.

BCM53158XUB0KFBGBCM53158XUB0KFBG

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