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— IC芯片 | 连接器 | 传感器 | 被动器件 —
The BCM5321MKPBG is a Layer 2 managed Ethernet switch integrated circuit manufactured by Broadcom Limited. It features 24 Gigabit ports and 2 additional Gigabit ports, supporting data rates of 1Gbps. The component utilizes a 400-pin Ball Grid Array (BGA) surface-mount package. It is designed for high-density networking applications requiring managed switching capabilities.
Verify current availability status as the component may be subject to limited supply or end-of-life conditions. Confirm RoHS compliance details through official documentation. Ensure compatibility with existing PCB designs due to the specific 400-pin BGA footprint requirements.
Select this component for applications requiring a high port count in a compact form factor. Consider the thermal management needs associated with the BGA package. Verify that the managed Layer 2 features align with the network control requirements of the target system design.
This part belongs to Broadcom's Ethernet IC portfolio, specifically within the communication and networking subcategory. It represents a solution for managed switching, distinct from unmanaged or higher-layer routing products offered by the manufacturer.
No public confirmed substitute part numbers are available in the provided documentation. Consult official Broadcom channels for potential obsolescence management or alternative component recommendations.