BCM55045B1IFSBG

Overview

The BCM55045B1IFSBG is an RF System on a Chip (SoC) manufactured by Broadcom Limited. Classified under Wireless & RF Integrated Circuits, this component utilizes Silicon technology and is designed for 10G XPON DPU applications. The device is identified as an RF SoC within the manufacturer's portfolio. Factory packaging quantities are listed at 308 units. The product adheres to RoHS standards, with specific compliance details available through the manufacturer.

Feature Summary

• Integrated RF System on a Chip (SoC) architecture
• Designed for 10G XPON DPU Chip applications
• Silicon-based technology implementation
• RoHS compliant manufacturing

Applications

• 10G XPON DPU Chip implementations

Procurement Notes

Verification of availability is required as distribution channels may indicate limited sales in certain regions. Confirm RoHS detailed status directly with the manufacturer or authorized distributor before procurement planning. Ensure the ordering suffix matches the specific package and temperature grade requirements for the target application.

Selection Notes

Select this component specifically for 10G XPON DPU designs requiring an integrated RF SoC solution. Verify that the silicon technology and package type align with the PCB layout constraints. Compare against other Broadcom RF SoCs if alternative performance metrics or pinouts are needed for the specific network interface requirements.

Part Context

This part belongs to the Broadcom Limited RF System on a Chip category. It is distinct from general-purpose wireless transceivers due to its specific optimization for 10G XPON DPU functions. The IFSBG suffix typically denotes the package style and lead finish, which should be verified against the mechanical drawings for assembly compatibility.

Replacement Considerations

No publicly confirmed substitute part numbers are available in the provided documentation. Consult Broadcom for direct replacements or pin-compatible alternatives suitable for 10G XPON DPU applications.