BCM55440B0IFSBG

BCM55440B0IFSBG

  • Description:24GE + 4X10GE SWITCH
  • Series:*

SKU:b8be726d3980 Category: Brand:

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Product Detailed Parameters

  • Description:24GE + 4X10GE SWITCH
  • Series:*
  • Mfr:Broadcom Limited
  • Package:Tray
  • Function:-
  • Interface:-
  • Number of Circuits:-
  • Voltage - Supply:-
  • Current - Supply:-
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Supplier Device Package:-
  • Power (Watts):-

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BCM55440B0IFSBG

Overview

The BCM55440B0IFSBG is a high-performance Ethernet switch integrated circuit manufactured by Broadcom Limited. It features a switching fabric capable of supporting 24 ports operating at 2.5 Gigabit Ethernet speeds and four ports operating at 10 Gigabit Ethernet speeds. The device is designed for dense access layer applications in data centers and enterprise networks, providing non-blocking switching performance with low latency. It integrates advanced quality of service (QoS) features, security mechanisms, and management capabilities to support scalable network infrastructures requiring high throughput and efficient bandwidth utilization.

Feature Summary

  • Supports mixed-speed port configurations combining 2.5GbE and 10GbE interfaces for flexible uplink options
  • Integrates hardware-based security features including MACsec encryption for data protection
  • Provides comprehensive traffic management through advanced QoS scheduling and policing mechanisms

Applications

  • High-density access switches in enterprise campus networks
  • Aggregation layers in data center top-of-rack deployments
  • Service provider edge equipment requiring multi-gigabit connectivity

Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels due to potential counterfeit risks. Confirm the specific suffix IFSBG matches design requirements as it denotes package type and temperature range. Check current lifecycle status as availability may be limited. Ensure proper ESD handling procedures during procurement and storage to maintain device integrity before installation.

Selection Notes

Evaluate thermal dissipation requirements for the BGA package in enclosed chassis designs. Verify compatibility with existing board layout constraints regarding pin assignments and power delivery networks. Consider firmware support longevity and available development tools for configuration. Assess whether the fixed port count meets future scalability needs without requiring major redesigns.

Part Context

This component belongs to Broadcom’s Trident series of switching ASICs, which are widely adopted in modern networking infrastructure. The BCM55440 variant specifically targets the growing demand for 2.5GbE endpoints while maintaining 10GbE uplink capabilities. It represents a transition point in network design where higher speed per-port efficiency becomes critical for cost-effective scaling.

Replacement Considerations

Check for newer generation Broadcom chips such as the BCM554xx family successors or compatible devices from other vendors offering similar port densities. Ensure pin-to-pin compatibility if replacing on existing PCBs. Verify software ecosystem support for migration.

BCM55440B0IFSBGBCM55440B0IFSBG

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