BCM56024B0KPBG

Overview

The BCM56024B0KPBG is a component within the Broadcom StrataXGS Tomahawk series, identified as an L3 Ethernet switch ASIC. The suffix B0KFSBG indicates a specific silicon stepping (B0) and large FBGA packaging format. This device belongs to the Tomahawk generation of data center networking silicon, designed for high-throughput switching applications. It supports flexible port configurations including 100GbE, 50GbE, and 25GbE interfaces via integrated SerDes. The architecture utilizes FleXGS match-action processing and includes hardware offloading capabilities for network virtualization protocols.

Feature Summary

• Supports hardware offloading for overlay tunneling protocols such as VXLAN, NVGRE, and MPLS.
• Integrates Smart-Buffer technology for dynamic packet buffering management.
• Provides hardware-based telemetry and flow statistics collection via BroadView.
• Enables high-density flow processing with Match-Action pipeline capabilities.

Applications

• Data Center Top-of-Rack (ToR) switching
• Leaf-Spine network fabric interconnects
• High-performance storage area networks

Procurement Notes

Verify the exact silicon revision and package marking against official Broadcom documentation before integration. Confirm that the B0 stepping meets the thermal and electrical requirements of the target design. Ensure compatibility with the required SDK version for intended protocol support. Request full datasheets and errata sheets from authorized distributors to validate manufacturing lot details.

Selection Notes

Select this component for designs requiring high-port-density Ethernet switching in data center environments. Evaluate the pin count and PCB layer requirements associated with the large FBGA package. Consider the power consumption profile relative to the available cooling infrastructure. Verify software support for required OpenFlow or SDN features through the appropriate Broadcom SDK release.

Part Context

This part is part of the broader StrataXGS portfolio, specifically the Tomahawk family released around 2014. It represents a generation of silicon focused on native 25G SerDes integration. The BCM56024 variant shares architectural similarities with other members like the BCM56960 but may differ in port density or specific feature sets. It serves as a foundational building block for modern cloud-scale networking equipment.

Replacement Considerations

Direct substitutes are not publicly confirmed for this specific stepping. Engineering changes may require evaluation of newer Tomahawk generations or compatible Broadcom switch ASICs. Cross-model comparison should focus on pinout compatibility and software migration paths rather than direct drop-in replacement.