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The BCM56160B0IFSBG is a System-on-a-Chip Ethernet switch optimized for enterprise edge applications. It integrates 24 Gigabit Ethernet ports, four 10GbE uplink or stacking ports, and sixteen embedded copper GPHYs within a 29 mm x 29 mm BGA package. The device features a 1.25 GHz ARM Cortex-A9 processor, 2 MB packet buffer, and supports IEEE 802.3az Energy Efficient Ethernet (EEE). Eight of the twenty-four ports support multirate operation at 2.5 Gbps for Wave2 access points. It utilizes StrataXGS architecture with HiGig-Duo stacking capabilities.
Verify the specific suffix against the manufacturer's official documentation to confirm temperature range and packaging details. Ensure compatibility with existing PCB layouts regarding the 29x29mm BGA footprint and DDR3 interface requirements before procurement.
Select this component for high-density edge deployments requiring integrated PHYs. Consider the BCM56161 if internal copper PHYs are not required. Evaluate the BCM56162 for configurations utilizing only 1GbE uplinks instead of 10GbE options.
This part belongs to the Broadcom BCM56160 family, which builds upon the BCM56150 series. It targets entry-level edge access applications for both enterprise and service provider markets, offering enhanced L3 capabilities and improved power efficiency compared to previous generations.
BCM56161: Identical functionality without integrated copper PHYs. BCM56162: Variant featuring four 1GbE uplinks instead of 10GbE ports.