BCM56242XB0IFSBLG

BCM56242XB0IFSBLG

  • Description:8X2.5GE+2X2.5GE
  • Series:*

SKU:34722c37a3c0 Category: Brand:

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Product Detailed Parameters

  • Description:8X2.5GE+2X2.5GE
  • Series:*
  • Mfr:Broadcom Limited
  • Package:Tray,Tray
  • Function:-
  • Interface:-
  • Number of Circuits:-
  • Voltage - Supply:-
  • Current - Supply:-
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Supplier Device Package:-
  • Power (Watts):-

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BCM56242XB0IFSBLG

Overview

The BCM56242XB0IFSBLG is a high-performance Ethernet switch IC from Broadcom Limited, designed for telecom and data center applications. It features an integrated architecture with eight 2.5 Gbps Ethernet ports and two additional 2.5 Gbps ports, totaling ten Gigabit Ethernet interfaces. The device supports mixed-class traffic handling without head-of-line blocking, ensuring efficient packet forwarding. It is housed in a BGA package and complies with RoHS standards, indicating lead-free construction suitable for environmentally conscious manufacturing processes.

Feature Summary

  • Integrates forwarding engines capable of handling mixed-class traffic without head-of-line blocking
  • Supports multiple Gigabit Ethernet interface configurations for versatile connectivity
  • Designed for multi-service environments requiring reliable packet processing

Applications

  • Telecom infrastructure equipment
  • Multi-service network switches
  • Data center interconnect solutions

Procurement Notes

Verify the specific ordering suffix IFSBLG against official Broadcom documentation to ensure correct package type and temperature range. Confirm RoHS compliance status through manufacturer datasheets rather than distributor claims. Check for any regional delivery restrictions or supply limitations before finalizing procurement plans.

Selection Notes

Select this component when designing systems requiring ten 2.5 Gbps Ethernet ports with advanced traffic management capabilities. Consider its suitability for multi-service applications where head-of-line blocking must be avoided. Evaluate thermal requirements and PCB layout constraints associated with its BGA packaging format during the design phase.

Part Context

This part belongs to Broadcom's Ethernet Switch IC family, targeting high-density networking solutions. It complements other Broadcom switch chips by offering specific port counts and speeds optimized for edge aggregation or access layer deployments in modern telecommunications networks.

Replacement Considerations

Consult Broadcom's official cross-reference guides for direct substitutes. Verify pin compatibility and software configuration differences if considering alternative models within the same product line.

BCM56242XB0IFSBLGBCM56242XB0IFSBLG

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