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Product Detailed Parameters
- Description：4X2.5G+4X10G+4X10G/HG SWITCH, I-
- Series：-
- Mfr：Broadcom Limited
- Package：Tray
- Function：-
- Interface：-
- Number of Circuits：-
- Voltage - Supply：-
- Current - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Power (Watts)：-
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Overview
The BCM56270A0IFEBG is an Ethernet switch System on a Chip (SoC) manufactured by Broadcom Limited. It features a port configuration of four 2.5 Gigabit Ethernet ports and four 10 Gigabit Ethernet ports, with support for 10 Gigabit stacking capabilities. The component operates within the industrial temperature range and integrates switching logic with MAC security functions.
Feature Summary
- Integrated System on a Chip architecture combining switching and control functions
- Supports 10 Gigabit stacking for scalable network expansion
- Operates within the industrial temperature range for robust performance
Applications
- Telecommunications infrastructure equipment
- High-density enterprise network switches
- Industrial networking applications requiring thermal stability
Procurement Notes
Verify the specific suffix 'IFEBG' against the manufacturer's official documentation to confirm pinout compatibility and package dimensions. Ensure that the industrial temperature rating aligns with your system's environmental requirements before integration. Cross-reference the datasheet revision history to confirm current manufacturing status and any potential design changes.
Selection Notes
Select this component when a compact SoC solution is required for networks needing mixed 2.5G and 10G connectivity. The integrated stacking feature reduces external controller complexity. Verify that the FCBGA package footprint matches your PCB layout constraints and that the power delivery network supports the chip's operational specifications.
Part Context
This part belongs to Broadcom's high-performance Ethernet switch portfolio designed for demanding environments. It serves as a core switching engine for devices requiring efficient traffic management between different Ethernet speeds. The SoC design consolidates multiple functions into a single silicon die to optimize board space and signal integrity.
Replacement Considerations
Consult Broadcom's official obsolescence notices or cross-reference tools for verified substitute part numbers. Generic equivalents are not recommended due to proprietary switching architectures. Ensure any replacement maintains the same package type and electrical characteristics.
