BCM56272A0IFEBG

BCM56272A0IFEBG

$124.58
  • Description:4X1G+4X1G SWITCH, I-TEMP
  • Series:*

SKU:9c47fcd581e0 Category: Brand:

  
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Product Detailed Parameters

  • Description:4X1G+4X1G SWITCH, I-TEMP
  • Series:*
  • Mfr:Broadcom Limited
  • Package:Tray,Tray
  • Function:-
  • Interface:-
  • Number of Circuits:-
  • Voltage - Supply:-
  • Current - Supply:-
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Supplier Device Package:-
  • Power (Watts):-

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BCM56272A0IFEBG

Overview

The BCM56272A0IFEBG is an RF System on a Chip (SoC) manufactured by Broadcom Limited. It functions as a 4x1 Gigabit Ethernet Carrier Switch integrated with four 1 Gigabit uplink ports. The component utilizes Silicon technology and belongs to the Wireless & RF Integrated Circuits subcategory. This specific part variant is designated for industrial temperature operation, ensuring functionality across extended thermal ranges required for robust network infrastructure applications.

Feature Summary

  • Integrates carrier switching capabilities with dedicated uplink interfaces within a single silicon die
  • Designed for industrial-grade environmental stability and reliability
  • Combines radio frequency processing with high-speed data switching functions

Applications

  • Industrial telecommunications equipment requiring integrated switching and RF processing
  • Network infrastructure nodes operating in extended temperature environments
  • Carrier-grade access points or base station units utilizing 1GE connectivity

Procurement Notes

Verify the exact suffix against official Broadcom documentation to confirm the industrial temperature grade and package configuration. Confirm RoHS compliance status through the manufacturer's current datasheet, as regulatory details may vary by production batch. Ensure the source document explicitly identifies this part number as an RF SoC to avoid confusion with standard digital switches.

Selection Notes

Select this component when a design requires the integration of carrier switching logic with 1 Gigabit Ethernet uplinks in a single package. The industrial temperature rating is critical for deployments in harsh environments where standard commercial grades would fail. Verify that the system architecture supports the specific RF SoC interface requirements defined in the official technical specifications.

Part Context

This device falls under the Broadcom RF System on a Chip category, specifically designed for wireless and RF integrated circuit applications. It represents a convergence of switching and radio technologies, distinct from general-purpose microcontrollers or standalone Ethernet controllers. The product line focuses on providing compact solutions for complex signal processing and data routing tasks in communication hardware.

Replacement Considerations

No public substitute part numbers are confirmed for this specific Broadcom model. Replacement requires careful evaluation of pin compatibility, electrical characteristics, and software support. Consult Broadcom engineering for approved alternatives if this component is unavailable.

BCM56272A0IFEBGBCM56272A0IFEBG
$124.58
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