BCM56300B1IEBG

BCM56300B1IEBG

  • Description:24 PORT GIGABIT ETHERNET MULTILA
  • Series:*

SKU:47367393a583 Category: Brand:

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Product Detailed Parameters

  • Description:24 PORT GIGABIT ETHERNET MULTILA
  • Series:*
  • Mfr:Broadcom Limited
  • Package:Tray
  • Protocol:-
  • Function:-
  • Interface:-
  • Standards:-
  • Voltage - Supply:-
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  • Operating Temperature:-
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BCM56300B1IEBG

Overview

The Broadcom BCM56300B1IEBG is a high-performance Ethernet switch chip belonging to the Trident II family. It features a non-blocking switching fabric capable of 2.56 Tbps throughput and supports up to 96 ports of 10 Gigabit Ethernet or 48 ports of 40 Gigabit Ethernet. The device integrates advanced Quality of Service (QoS) mechanisms, including deep packet buffering and traffic shaping. It supports comprehensive Layer 2 through Layer 4 switching functions, hardware-based security features, and precise synchronization protocols such as IEEE 1588v2 PTP for telecommunications applications.

Feature Summary

  • Supports high-density 10G and 40G Ethernet port configurations with non-blocking architecture
  • Integrates hardware-accelerated QoS for complex traffic management and prioritization
  • Provides robust security features including ACLs and encryption offload capabilities
  • Enables precise time synchronization via IEEE 1588v2 support for network timing

Applications

  • Core and aggregation layer routing in service provider networks
  • High-speed data center spine and leaf switches
  • Enterprise campus core switching infrastructure
  • Telecommunications base station backhaul equipment

Procurement Notes

Verify the specific suffix 'B1IEBG' against official Broadcom documentation to confirm pinout compatibility and temperature range specifications. Ensure that the source component matches the required lead-free status and RoHS compliance standards mandated by your target market regulations before finalizing procurement orders.

Selection Notes

Select this component when designing systems requiring high port density and low latency switching. Evaluate thermal management requirements carefully due to the high power dissipation associated with full port utilization. Confirm that the PCB layout supports the necessary ball grid array package constraints and signal integrity requirements for high-speed serial interfaces.

Part Context

This part belongs to the Trident II series, representing a generation of high-throughput switching solutions designed for scalable network architectures. It serves as a foundational component for modern high-speed networking equipment, bridging the gap between traditional enterprise switching and carrier-grade performance requirements in converged network environments.

Replacement Considerations

Direct pin-to-pin replacements are limited within the same family. Consider the BCM56340 or BCM56344 for higher port counts if system scalability is required. Verify software driver compatibility and register-level differences when migrating between different revisions of the Trident II family.

BCM56300B1IEBGBCM56300B1IEBG

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