BCM56312A0IFEB

BCM56312A0IFEB

  • Description:24 PORT GIGABIT ETHERNET + 2*10G
  • Series:*

SKU:fbb2cec8168f Category: Brand:

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Product Detailed Parameters

  • Description:24 PORT GIGABIT ETHERNET + 2*10G
  • Series:*
  • Mfr:Broadcom Limited
  • Package:Tray
  • Protocol:-
  • Function:-
  • Interface:-
  • Standards:-
  • Voltage - Supply:-
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  • Operating Temperature:-
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BCM56312A0IFEB

Overview

The Broadcom BCM56312A0IFEB is a high-performance Ethernet switch chip designed for dense data center and enterprise switching applications. It delivers non-blocking switching capacity with support for multiple Gigabit Ethernet ports and high-speed uplinks. The device integrates advanced packet buffering, memory management, and hardware-based security features to ensure low latency and high throughput. It supports industry-standard protocols including IEEE 802.3az Energy Efficient Ethernet and IEEE 1588v2 Precision Time Protocol for network synchronization. The component utilizes an FBGA package suitable for surface-mount assembly in complex networking infrastructure.

Feature Summary

  • High-density port configuration supporting numerous Gigabit Ethernet interfaces
  • Integrated hardware acceleration for security policies and traffic classification
  • Support for stackable architectures enabling scalable network expansion
  • Advanced power management capabilities compliant with energy efficiency standards

Applications

  • Top-of-rack switches in high-density data centers
  • Enterprise core and distribution layer switching
  • Service provider edge aggregation platforms
  • Industrial networking equipment requiring robust packet processing

Procurement Notes

Verify the specific ordering suffix against the official Broadcom datasheet to confirm pinout compatibility and temperature range. Ensure the source provides valid traceability documentation. Confirm that the component matches the exact part number designation to avoid functional mismatches in critical network infrastructure deployments.

Selection Notes

Select this component for designs requiring high port density and integrated Layer 2/Layer 3 switching capabilities. Evaluate thermal dissipation requirements due to the high integration level. Ensure the host system design supports the required interface standards such as SGMII or XFI for uplink connectivity. Verify software support availability for the intended switching features.

Part Context

This model belongs to the Broadcom Trident family of switching solutions, which are widely adopted in modern network infrastructure. The series is characterized by high scalability and integration, allowing manufacturers to reduce board space while increasing port counts. It serves as a key enabler for next-generation switching architectures in both commercial and industrial sectors.

Replacement Considerations

Consult official Broadcom documentation for qualified replacement parts within the same product family. Ensure any substitute maintains identical pinout and electrical characteristics. Cross-reference with approved vendor lists to verify compatibility before implementation.

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