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The BCM56463B0IFSBG is a telecom interface integrated circuit manufactured by Broadcom Limited. It functions as a backhaul access switch designed for telecommunications infrastructure applications. The component belongs to the BCM56460 basic product family and is classified under Ethernet ICs within the broader category of wireless and RF integrated circuits. It utilizes silicon technology and is offered in an RoHS3 compliant configuration. The device supports industrial temperature ranges and is packaged in a BGA format with specific factory pack quantities, such as 189 units per tray, intended for high-volume electronic assembly processes.
Verify the exact ordering suffix against the manufacturer's current datasheet to ensure compatibility with required package types and temperature grades. Confirm RoHS3 compliance status directly with the supplier, as regulatory requirements may vary by region. Check for active lifecycle status and availability constraints, as supply chain limitations may affect lead times. Ensure that the specific variant matches the design-in requirements for pinout and functionality before finalizing procurement orders.
Select this component when designing systems requiring dedicated backhaul access switching solutions within the Broadcom BCM56460 family. Evaluate thermal management requirements based on the specified operating temperature range. Consider the physical package dimensions and ball grid array configuration for PCB layout compatibility. Review the official datasheet for signal integrity specifications and power consumption profiles to ensure alignment with system performance targets.
This part is a member of the Broadcom BCM56460 series, which targets high-performance networking applications. It serves as a specialized solution for aggregating traffic in access networks. The designation includes specific identifiers for package type, temperature rating, and compliance status, distinguishing it from other variants within the same functional family.
Consult the official Broadcom replacement guide for qualified substitute part numbers. Verify pin-to-pin compatibility and functional equivalence before substituting. Cross-reference the latest datasheets to confirm any changes in specifications or packaging.