BCM56475A0KFSBG

BCM56475A0KFSBG

$2,352.12
  • Description:TD3X4 W/O BROADSCAN -400 LOGICAL
  • Series:-

SKU:06891bf214ba Category: Brand:

  
  • Quantity
    • -
    • +
  •    
ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:TD3X4 W/O BROADSCAN -400 LOGICAL
  • Series:-
  • Mfr:Broadcom Limited
  • Package:Tray
  • Function:-
  • Interface:-
  • Number of Circuits:-
  • Voltage - Supply:-
  • Current - Supply:-
  • Operating Temperature:-
  • Mounting Type:-
  • Package / Case:-
  • Supplier Device Package:-
  • Power (Watts):-

Download product information

BCM56475A0KFSBG

Overview

The BCM56475A0KFSBG is an RF System on a Chip (SoC) manufactured by Broadcom Limited. Classified under Wireless & RF Integrated Circuits, this component utilizes Silicon technology and is designed for chassis switch applications with a specified throughput of 1.7 Tbps. The device is identified by the trademark Broadcom / Avago and falls within the Ethernet IC product category. It is supplied in a factory pack quantity of 84 units.

Applications

  • Chassis switch systems
  • Wireless and RF integrated circuit designs
  • High-throughput network infrastructure

Procurement Notes

Verify availability status directly with authorized distributors or the manufacturer, as supply conditions may be restricted. Confirm RoHS compliance details through official documentation before integration. Ensure the ordering suffix matches the required package and temperature specifications to avoid functional mismatches during procurement.

Selection Notes

Select this SoC when a 1.7 Tbps switching capacity is required for chassis-based architectures. Evaluate compatibility with existing silicon-based RF system requirements. Consider the specific packaging constraints associated with the KFSBG suffix and ensure the design supports the necessary thermal management for the intended operating environment.

Part Context

This component belongs to the Broadcom BCM series of networking and connectivity solutions. It represents a specialized System on a Chip variant tailored for high-performance switching applications. The part integrates core processing and RF functionalities into a single silicon die, distinguishing it from standard discrete Ethernet controllers or PHYs within the broader portfolio.

FAQ

What is the primary throughput specification for the BCM56475A0KFSBG?

The device is specified for a throughput of 1.7 Tbps.

Which manufacturing technology is used for this SoC?

The component is built using Silicon technology.

Is this part classified as an Ethernet IC?

Yes, it is categorized under Ethernet ICs and RF System on a Chip products.

BCM56475A0KFSBGBCM56475A0KFSBG
$2,352.12
Buy Now