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The BCM56844LA1IFRBLG is a multi-layer Ethernet switch integrated circuit manufactured by Broadcom Limited. It belongs to the BCM56844 series, designed for high-density switching applications. The component operates within standard industrial temperature ranges and supports RoHS3 compliance. It utilizes a ball grid array package suitable for surface mount technology. The device integrates advanced switching fabric capabilities with embedded memory management units to handle complex network traffic patterns efficiently.
Verify authenticity through authorized distributors as this part may be subject to obsolescence notices. Check for specific suffix variations that indicate temperature grades or packaging options. Confirm end-of-life status with the manufacturer before finalizing procurement plans to ensure long-term supply stability.
Select this component for designs requiring high throughput and low latency in dense switching environments. Ensure the printed circuit board layout accommodates the required thermal dissipation for the specific package type. Verify compatibility with existing MAC interfaces and clocking requirements during the initial design phase.
This part is a member of the Broadcom BCM56844 family of multi-layer switches. It shares architectural similarities with other devices in the series but offers specific pinout and feature configurations tailored for particular form factors. The series is known for integrating significant processing power within a compact footprint.
Consult official Broadcom documentation for direct cross-references. Alternative solutions may require significant schematic and firmware modifications due to proprietary switching fabric differences.