BCM56960B0KFSBG

BCM56960B0KFSBG

  • Description:3.2TB DATA CENTER SWITCH
  • Series:*

SKU:cbebdffb9047 Category: Brand:

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Product Detailed Parameters

  • Description:3.2TB DATA CENTER SWITCH
  • Series:*
  • Mfr:Broadcom Limited
  • Package:Tray
  • Function:-
  • Interface:-
  • Number of Circuits:-
  • Voltage - Supply:-
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  • Power (Watts):-

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BCM56960B0KFSBG

Overview

The BCM56960B0KFSBG is a third-generation StrataXGS Tomahawk L3 Ethernet switch ASIC designed for high-performance data center applications. It delivers a total switching capacity of 3.2 Tbps with a forwarding latency of less than 400 nanoseconds. The device integrates 128 lanes of 25 Gbps SerDes, supporting flexible port configurations including 32x100GbE, 64x50GbE, or 128x25GbE. Built on a mature process node, it features the FleXGS architecture for high-density flow processing and supports hardware offloading for VXLAN, NVGRE, and MPLS protocols.

Feature Summary

  • Native 25G SerDes support enabling direct connectivity to 25G servers and compatibility with 25G/50G Ethernet Consortium standards.
  • Hardware acceleration for overlay tunneling protocols including VXLAN, NVGRE, and MPLS to facilitate cloud network virtualization.
  • Integration of BroadView telemetry for real-time flow statistics, link health monitoring, and packet tracing to reduce operational expenses.
  • Smart-Buffer technology providing dynamic cache management that significantly outperforms static buffer architectures.

Applications

  • Top-of-Rack (ToR) switches connecting 128x25GbE server ports with uplinks to higher-speed fabrics.
  • Leaf-Spine interconnects utilizing 32x100GbE ports for full-mesh high-bandwidth data center topologies.
  • Storage area networks requiring low-latency forwarding for RDMA over Converged Ethernet (RoCE) traffic.

Procurement Notes

Verify component authenticity through authorized distributors as this part number may be subject to obsolescence notices. Confirm RoHS compliance status and check for specific product change notifications regarding package revisions. Ensure supply chain partners provide valid traceability documentation for critical infrastructure deployments.

Selection Notes

Select this ASIC for designs requiring native 25G interface density without external retimers. Evaluate PCB stack-up requirements for large-pin-count FBGA packages and high-speed signal integrity. Consider multi-chip HiGig expansion capabilities if chassis-based scalability exceeds single-chip port counts.

Part Context

This component belongs to the Broadcom StrataXGS Tomahawk family, representing an evolution in high-throughput switching silicon. It serves as a foundational building block for enterprise and cloud provider networking equipment, bridging the transition from 10G to 100G backbone speeds while maintaining high port density for server access layers.

Replacement Considerations

Direct pin-to-pin replacements are not available due to architectural differences. Consider the BCM56970 series for higher throughput or the BCM56860 series for lower cost points. Validate software compatibility with existing Network Operating Systems before migrating to alternative silicon families.

BCM56960B0KFSBGBCM56960B0KFSBG

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