BCM56980B0KFSBG

BCM56980B0KFSBG

$5,520.55
  • Description:32X400G MULTI-LAYER SWITCH
  • Series:-

SKU:2f39c497dd7d Category: Brand:

  
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Product Detailed Parameters

  • Description:32X400G MULTI-LAYER SWITCH
  • Series:-
  • Mfr:Broadcom Limited
  • Package:Tray
  • Function:-
  • Interface:-
  • Number of Circuits:-
  • Voltage - Supply:-
  • Current - Supply:-
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BCM56980B0KFSBG

Overview

The BCM56980B0KFSBG is a high-performance StrataXGS Tomahawk 2 L3 Ethernet Switch ASIC manufactured by Broadcom Limited. Designed for next-generation data center architectures, this component delivers a total switching capacity of 12.8 Tbps with a forwarding throughput of 9.6 Gpps. The device integrates 128 lanes of 100 Gbps SerDes, supporting flexible port configurations including 128x100G, 64x200G, or 32x400G interfaces. It utilizes a single-stage architecture to minimize latency and power consumption while providing extensive hardware offload capabilities for overlay networks and telemetry.

Feature Summary

  • Single-stage non-blocking architecture enabling low-latency packet processing without internal buffering bottlenecks.
  • Hardware-accelerated support for VXLAN, NVGRE, MPLS, and SPB tunneling protocols for cloud network virtualization.
  • Integrated BroadView Gen 4 telemetry engine providing real-time visibility into flow statistics, link health, and congestion events.
  • Advanced Smart-Buffer technology offering dynamic memory allocation to prevent head-of-line blocking during traffic bursts.

Applications

  • High-density 400G Leaf-Spine data center fabric topologies
  • Core aggregation switches requiring 12.8 Tbps aggregate bandwidth
  • AI/ML training clusters utilizing RoCEv2 for storage area networking
  • Service provider edge routers demanding high-throughput packet classification

Procurement Notes

Verify the specific silicon stepping (B0) and package variant (KF) against current engineering change notices. Confirm SDK compatibility with existing network operating systems before integration. Ensure supply chain authenticity through authorized distributors due to potential obsolescence risks associated with older generation components.

Selection Notes

Evaluate thermal requirements carefully as the large FBGA package generates significant heat under full load. Compare against newer generations like Tomahawk 3 or 4 if 400G native density is critical. Assess PCB layer count and impedance control capabilities required for 100G+ signal integrity. Verify pinout compatibility with existing reference designs to reduce development time.

Part Context

This component belongs to the Broadcom StrataXGS Tomahawk 2 family, succeeding the Tomahawk 1 series. It represents a major architectural shift towards higher port densities and 400G readiness compared to its predecessors. The part is widely recognized in enterprise and hyperscale data center deployments prior to the widespread adoption of subsequent generations.

Replacement Considerations

Direct functional equivalents include the BCM56990B0KFSBG (Tomahawk 3) for enhanced performance. Cross-compatibility checks are required when migrating from BCM56960 series devices due to architectural differences in buffer management and I/O configurations.

BCM56980B0KFSBGBCM56980B0KFSBG
$5,520.55
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