ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
Product Detailed Parameters
- Description：24P/35B DSL DSP
- Series：-
- Mfr：Broadcom Limited
- Package：Tray
- Function：-
- Interface：-
- Number of Circuits：-
- Voltage - Supply：-
- Current - Supply：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Power (Watts)：-
Download product information
Overview
The BCM65235D0IFSBG is a network controller and processor IC manufactured by Broadcom Limited. It functions as a DSL Digital Signal Processor (DSP) designed for broadband communication applications. The component is housed in a BGA package with 35 balls, featuring a 24-pin interface configuration. It belongs to the communication and networking ICs sub-category under the Broadcom/Avago trademark. The device supports RoHS compliance standards and is intended for integration into DSL modem and router architectures requiring high-performance signal processing capabilities.
Feature Summary
- Integrated digital signal processing architecture optimized for DSL line coding and modulation tasks
- Compact ball grid array packaging suitable for space-constrained consumer electronics designs
- Compliance with environmental restriction standards for electronic components
Applications
- ADSL and VDSL modem implementations
- Broadband router internal processing units
- Gateway devices requiring DSL connectivity
Procurement Notes
Verify the authenticity of the supplier through authorized distribution channels or direct manufacturer engagement. Confirm that the delivered units match the exact suffix specifications and packaging requirements. Request original factory documentation or test reports to ensure component integrity before integration into production systems.
Selection Notes
Evaluate the compatibility of the 35-ball BGA footprint with the target printed circuit board layout. Ensure the design supports the specific thermal dissipation requirements associated with this package type. Verify that the system power supply rails align with the operational voltage specifications defined in the official datasheet.
Part Context
This component is part of Broadcom's portfolio of communication and networking integrated circuits. It falls under the broader category of network controllers and processors utilized in telecommunications infrastructure. The product line focuses on enabling high-speed data transmission over copper-based telephone lines for residential and small business connectivity solutions.
