BCM82070BKFSBG

BCM82070BKFSBG

  • Description:4X25G BIDIR (BACKPLANE)
  • Series:-

SKU:f05e7c11c586 Category: Brand:

ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:4X25G BIDIR (BACKPLANE)
  • Series:-
  • Mfr:Broadcom Limited
  • Package:Bulk
  • Protocol:-
  • Function:-
  • Interface:-
  • Standards:-
  • Voltage - Supply:-
  • Current - Supply:-
  • Operating Temperature:-
  • Package / Case:-
  • Supplier Device Package:-
  • Grade:-
  • Qualification:-

Download product information

BCM82070BKFSBG

Overview

The BCM82070BKFSBG is a high-performance interface controller manufactured by Broadcom Limited, designed for demanding backplane connectivity applications. This component provides four independent channels of bidirectional data transmission, with each channel supporting a signaling rate of 25 Gbps. The integrated architecture enables efficient signal integrity management and protocol handling across high-speed interconnects. It serves as a critical element in modern network infrastructure equipment requiring robust and scalable serial link capabilities.

Feature Summary

  • Supports four-channel bidirectional data transmission
  • Optimized for high-speed backplane connectivity environments
  • Integrates advanced signal processing for reliable communication

Applications

  • High-speed network switch backplanes
  • Server interconnect systems
  • Storage area network infrastructure

Procurement Notes

Verify the specific package marking and date code against official Broadcom documentation to ensure authenticity. Confirm that the device meets all environmental specifications required for the target application environment. Request detailed test reports or compliance certificates from authorized distributors to validate performance characteristics prior to integration into final hardware designs.

Selection Notes

Select this component when designing systems requiring multiple high-speed bidirectional links on a single substrate. Evaluate board layout constraints and thermal requirements associated with high-density backplane implementations. Ensure compatibility with existing protocol stacks and physical layer standards supported by the four-channel architecture for seamless system integration.

Part Context

This part belongs to Broadcom's portfolio of high-speed interface solutions, focusing on enabling reliable data transfer in complex electronic systems. It addresses the growing demand for bandwidth-intensive connections within enterprise networking and computing hardware sectors.

Replacement Considerations

Consult official Broadcom substitution guides for compatible alternatives. Verify pinout compatibility and electrical parameter alignment before considering any cross-reference parts.

BCM82070BKFSBGBCM82070BKFSBG

Click on the inquiry