BCM82793AKFSBG

Overview

The BCM82793AKFSBG is a high-frequency switching power management integrated circuit manufactured by Broadcom Limited. Designed for surface-mount technology (SMT) installation, this component operates within an extended industrial temperature range of -40°C to +85°C. It delivers a regulated output voltage of 600 mV with a maximum continuous output current capability of 20 A. The device features a compact physical footprint measuring 3.1 mm in length and is housed in a BGA package configuration. It incorporates internal logic functions associated with data storage and utilizes a transistor count of approximately 30,000 units. The unit is rated for operation at CPU main frequencies and is engineered to maintain performance under varying thermal conditions typical of dense electronic assemblies.

Feature Summary

• High-frequency switching regulation architecture optimized for stable power delivery in demanding environments
• Integrated thermal management capabilities supporting reliable operation across wide industrial temperature extremes
• Compact surface-mount form factor designed for high-density printed circuit board integration

Applications

• Central processing unit core voltage regulation modules
• High-performance computing system power distribution networks
• Industrial control electronics requiring robust power stability

Procurement Notes

Verify the manufacturer date code and lot traceability upon receipt to ensure compliance with project specifications. Confirm that the received components match the specified package dimensions and pinout configurations exactly. Inspect the terminals for any signs of oxidation or mechanical damage prior to assembly. Ensure that storage conditions adhere to moisture sensitivity level requirements to prevent soldering defects during the reflow process.

Selection Notes

Select this component when a low-voltage, high-current power solution is required for processor cores. Evaluate the thermal dissipation requirements of the host design against the component's operating limits. Consider the physical space constraints on the PCB layout relative to the package size. Verify compatibility with the target switching frequency and control loop requirements of the power supply topology.

Part Context

This part belongs to the Broadcom portfolio of power management solutions. Broadcom has evolved through significant industry consolidations, including the acquisition of Avago Technologies' semiconductor assets. The company maintains a broad range of integrated circuits for networking and computing applications, positioning this power chip within their broader ecosystem of hardware components for enterprise and industrial systems.

Replacement Considerations

No publicly confirmed substitute part numbers are available for this specific component identifier.