BCR 103T E6327

Overview

The BCR 103T E6327 is an NPN silicon digital transistor from Infineon Technologies, featuring a built-in bias resistor network with R1 and R2 both at 2.2 kΩ. It operates with a collector-emitter voltage of 50 V and a maximum collector current of 100 mA. The device is housed in the SC75 package (SOT-323) and supports a total power dissipation of 250 mW at a case temperature up to 109°C. Key electrical characteristics include a DC current gain of 20 at 20 mA, a transition frequency of 140 MHz, and a junction temperature range up to 150°C.

Feature Summary

• Integrated dual bias resistors for simplified circuit design
• High-speed switching capability with defined transition frequency
• Compact surface-mount packaging for space-constrained applications

Applications

• Switching circuits
• Inverter circuits
• Interface circuits
• Driver circuits

Procurement Notes

Verify the specific suffix 'E6327' corresponds to the SC75 reel packaging configuration before ordering. Confirm that the component meets all required thermal and electrical specifications for the intended operating environment. Ensure compatibility with existing PCB footprints designed for the SC75 outline dimensions.

Selection Notes

Select this component when a compact NPN digital transistor with integrated biasing is required. Consider the 50 V collector-emitter voltage rating and 100 mA current limit against load requirements. Evaluate the SC75 package suitability for automated assembly processes and available board space constraints.

Part Context

This part belongs to the BCR 103 series of NPN silicon digital transistors. The 'T' designation indicates the SC75 package variant, while 'E6327' specifies the tape and reel packaging code. Other variants in the series include the F and L3 packages, offering different thermal and physical characteristics for diverse application needs.

Replacement Considerations

Direct substitutes within the same series include BCR 103F and BCR 103L3, which share identical electrical characteristics but differ in package type (TSFP-3 and TSLP-3-4 respectively). Verify pinout compatibility and thermal resistance values when considering these alternatives.