BCR 189L3 E6327

Overview

The BCR 189L3 E6327 is a PNP silicon digital transistor manufactured by Infineon Technologies. It integrates a single NPN transistor with a built-in bias resistor of 22 kΩ (typical). The device operates with a collector-emitter voltage of 50 V and a continuous collector current of 100 mA. Total power dissipation is rated at 250 mW for the L3 package variant. The transition frequency reaches 200 MHz, supporting high-speed switching applications. It utilizes the TSLP-3-4 surface-mount package.

Feature Summary

• Integrates a PNP transistor with a fixed internal bias resistor to simplify circuit design
• Optimized for high-speed switching operations in digital logic environments
• Designed for compact surface-mount assembly using small outline packages

Applications

• Switching circuits
• Inverter stages
• Interface circuits
• Driver circuits

Procurement Notes

Verify component authenticity through authorized distribution channels. Confirm RoHS compliance status via official documentation. Check for obsolescence notices as manufacturing lifecycles change. Ensure storage conditions remain within specified temperature ranges to maintain electrical integrity prior to assembly.

Selection Notes

Select this component when a PNP digital switch with integrated base resistance is required. Verify that the 50 V collector-emitter rating meets system voltage requirements. Ensure the 100 mA collector current capacity aligns with load specifications. Confirm thermal management capabilities match the application's power dissipation needs.

Part Context

This part belongs to the BCR series of digital transistors from Infineon Technologies. The series combines bipolar junction transistors with on-chip resistors to reduce board space and component count. The L3 suffix indicates the specific TSLP-3-4 packaging configuration used for this variant.

Replacement Considerations

Consult official replacement lists for verified substitutes. Cross-reference pin configurations and electrical parameters before substitution. Verify package compatibility and thermal characteristics. Ensure functional equivalence in switching speed and gain.