BCR573E6327HTSA1

Overview

The BCR573E6327HTSA1 is a PNP silicon digital transistor manufactured by Infineon Technologies, housed in an SOT-23-3 surface-mount package. It features an integrated base resistor network with a typical input resistance of 1 kOhms and a typical resistor ratio of 0.1. The device supports a maximum collector-emitter voltage (VCEO) of 50 V and handles a continuous collector current of 500 mA. Key electrical specifications include a minimum DC current gain (hFE) of 70 and a maximum power dissipation of 280 mW. It operates within a temperature range of -65°C to +150°C and holds AEC-Q100 qualification for automotive applications.

Feature Summary

• Integrated base resistors simplify driver circuit design by reducing component count.
• High switching speed suitable for high-frequency digital applications.
• Automotive-grade reliability certified under AEC-Q100 standards.

Applications

• Load switching in automotive electronic control units
• Driver circuits for relays and solenoids
• Logic level translation between microcontrollers and peripheral devices

Procurement Notes

Verify the specific ordering suffix E6327HTSA1 to confirm the reel packaging quantity and tape-and-reel specifications. Confirm that the AEC-Q100 qualification meets the required automotive grade for the target application. Check for any end-of-life notices or alternative recommendations from the manufacturer before finalizing procurement plans.

Selection Notes

Select this component when a compact PNP digital switch with integrated biasing is required. Ensure the 50 V collector-emitter voltage rating exceeds the maximum circuit voltage. Verify that the 500 mA continuous current capability matches the load requirements. Consider the SOT-23-3 footprint constraints during PCB layout design.

Part Context

This part belongs to the BCR573 series of PNP digital transistors from Infineon. The series offers various configurations with different internal resistor values to suit diverse logic interface needs. The E6327HTSA1 designation specifically identifies the standard SMD reel packaging format used for automated assembly processes.

Replacement Considerations

Check for direct cross-reference parts with identical pinout and electrical ratings. Verify compatibility of internal resistor values if replacing with other digital transistor models. Ensure thermal performance and package dimensions match the existing board space.