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BD1050CS_S2_00001 is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Panjit International Inc.. Its product description is DIODE ARRAY SCHOT 50V 10A TO-252. Review the specifications below when checking this part for your BOM.
The BD1050CS_S2_00001 is a surface mount Schottky barrier rectifier from the BD1040CS series by Panjit International Inc. It features a TO-252 molded plastic case and supports a maximum repetitive peak reverse voltage of 50 V with a maximum average forward rectified current of 10 A. The device exhibits a typical junction capacitance suitable for high-frequency applications and operates within a temperature range of -65 to +175 °C. It complies with EU RoHS 2.0 standards and utilizes green molding compound per IEC 61249.
Verify the specific ordering suffix against official documentation to confirm packaging orientation and quantity. Confirm that the component meets required environmental standards for the intended deployment environment. Ensure compatibility with existing thermal management solutions given the specified thermal resistance characteristics.
Select this component for applications requiring robust surge capacity and low power loss. Consider the TO-252 package dimensions for PCB layout constraints. Evaluate the maximum forward voltage drop at rated current to ensure system efficiency targets are met under expected operating loads.
This part belongs to the BD1040CS series of surface mount Schottky barrier rectifiers manufactured by Panjit International Inc. The series covers voltage ratings from 40 V to 200 V while maintaining a consistent 10 A current rating across variants. These devices are engineered for general-purpose rectification in compact electronic designs.
Consult official datasheets for direct substitutes within the same series or equivalent specifications from other manufacturers. Verify pinout compatibility and thermal performance metrics before implementation.
The maximum repetitive peak reverse voltage (VRRM) for the BD1050CS is 50 V.
Yes, the datasheet indicates the package is suitable for through-hole applications despite being a surface mount device.
The device features a typical junction capacitance curve provided in the datasheet, optimized for high-frequency operation.
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