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The BFR750L3RHE6327XTSA1 is an NPN Silicon Germanium RF transistor designed for high-gain, ultra-low noise applications up to 10 GHz. It features a TSLP-3-9 leadless package with a maximum height of 0.32 mm and is AEC-Q101 qualified. Key electrical parameters include a collector-emitter voltage (VCEO) of 4 V, a continuous collector current (IC) of 90 mA, and a total power dissipation (Ptot) of 360 mW at a soldering point temperature of 96°C. The device exhibits a transition frequency (fT) of 37 GHz, a DC current gain (hFE) ranging from 160 to 400, and a typical noise figure of 0.6 dB at 1.8 GHz.
Verify the specific ordering suffix against official Infineon documentation to confirm package type and compliance status. Confirm that the requested part number matches the exact marking code R8 and pin configuration defined in the datasheet. Ensure procurement channels provide valid traceability for AEC-Q101 qualified components.
Select this component when designing circuits requiring high linearity and low noise figures in the sub-10 GHz spectrum. Consider the 4 V collector-emitter voltage limit and 90 mA current capability during biasing. Evaluate the thermal resistance requirements given the 360 mW power dissipation rating in the TSLP-3-9 package.
This component belongs to the BFR750L3 series of Silicon Germanium RF transistors manufactured by Infineon Technologies. It utilizes 150 GHz fT technology to deliver superior RF performance in a compact form factor. The product is specifically engineered to meet automotive reliability standards through its AEC-Q101 qualification.
Consult official Infineon replacement guides for verified substitutes. Cross-reference pin configurations and electrical limits before substituting.