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BGM7LMHM4L12E6327XTSA1 is listed in the RF Amplifiers range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC AMP LTE 700MHZ-2.7GHZ TSLP12. Review the specifications below when checking this part for your BOM.
RF Amplifiers specifications for BGM7LMHM4L12E6327XTSA1
- Description：IC AMP LTE 700MHZ-2.7GHZ TSLP12
- Series：-
- Mfr：Infineon Technologies
- Package：Tape & Reel (TR),Bulk
- Frequency：700MHz ~ 2.7GHz
- P1dB：-
- Gain：13dB
- Noise Figure：-
- RF Type：LTE
- Voltage - Supply：1.5V ~ 3.3V
- Current - Supply：4.5mA
- Test Frequency：-
- Mounting Type：Surface Mount
- Package / Case：12-XFQFN Exposed Pad
- Supplier Device Package：TSLP-12-4
- Grade：-
- Qualification：-
RF Amplifiers datasheet and documents for BGM7LMHM4L12E6327XTSA1
RF Amplifiers Overview
The BGM7LMHM4L12E6327XTSA1 is a silicon MMIC RF amplifier manufactured by Infineon Technologies. It operates within the frequency range of 700 MHz to 2.7 GHz, covering LTE bands. The device is housed in a TSLP-12 package. It is designed for low noise and high linearity applications in wireless communication systems.
RF Amplifiers Feature Summary
- Integrated silicon MMIC design for compact integration
- Optimized performance across LTE frequency bands
- Low noise figure characteristics for signal integrity
RF Amplifiers Applications
- LTE base station front-end modules
- Wireless communication infrastructure equipment
- Broadband RF signal amplification
RF Amplifiers Procurement Notes
Verify component authenticity through official Infineon channels or authorized distributors. Confirm datasheet revisions and RoHS compliance status prior to integration. Ensure supply chain stability as availability may vary by region. Cross-reference ordering suffixes with official documentation to confirm exact specifications.
RF Amplifiers Selection Notes
Select this component for designs requiring broadband amplification within the 700 MHz to 2.7 GHz spectrum. Evaluate thermal management requirements due to the TSLP-12 package constraints. Compare noise figure and gain flatness against specific system link budget requirements. Ensure impedance matching networks are compatible with the MMIC input and output impedances.
RF Amplifiers Part Context
This part belongs to Infineon's portfolio of RF silicon MMICs. It serves as a building block for modern cellular infrastructure. The TSLP-12 package allows for surface-mount assembly. It complements other passive and active components in RF front-end assemblies.
RF Amplifiers Replacement Considerations
Consult official Infineon substitution guides for verified alternatives. Generic replacements may not match the specific S-parameters or package footprint. Verify pin compatibility and electrical performance equivalence before considering any substitute parts.
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