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Product Detailed Parameters
- Description：IC TELECOM INTERFACE SMD
- Series：-
- Mfr：Infineon Technologies
- Package：Tape & Reel (TR),Bulk
- Function：Transceiver
- Interface：-
- Number of Circuits：1
- Voltage - Supply：-
- Current - Supply：1 ~ 4mA
- Operating Temperature：-
- Mounting Type：Surface Mount
- Package / Case：119-WFBGA, WLBGA
- Supplier Device Package：PG-WFWLB-119-1
- Power (Watts)：-
- Grade：-
- Qualification：-
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Overview
The BGT60E6327XTSA1 is a silicon-based RF transceiver designed for LTE and WiMAX applications. It operates within the mmWave frequency range, specifically targeting wireless infrastructure and consumer IoT sectors. The component integrates transmission and reception capabilities into a single chip, utilizing standard surface-mount technology for PCB integration. This device supports high-frequency signal processing required for modern broadband communication standards.
Feature Summary
- Integrated RF transceiver functionality for LTE and WiMAX protocols
- Silicon-based construction for cost-effective mass production
- Designed for mmWave wireless infrastructure applications
Applications
- LTE base station front-ends
- WiMAX access points
- Wireless infrastructure equipment
Procurement Notes
Verify current availability status as this component may be subject to discontinuation or limited supply constraints. Confirm RoHS compliance details through official Infineon documentation before finalizing procurement plans. Ensure compatibility with existing design specifications regarding package type and thermal requirements.
Selection Notes
Select this component for designs requiring integrated LTE and WiMAX support in the mmWave spectrum. Consider the silicon technology node for manufacturing scalability. Evaluate system-level requirements against the specific frequency bands supported by this transceiver to ensure adequate performance coverage.
Part Context
This part belongs to Infineon's portfolio of wireless RF integrated circuits. It serves as a specialized solution for fixed wireless access and cellular infrastructure markets. The component represents a consolidation of RF functions to reduce board space and simplify assembly processes for telecommunications equipment manufacturers.
Replacement Considerations
Check for updated revisions within the BGT60 series. Consult Infineon engineering for direct pin-compatible alternatives if this specific suffix is unavailable. Verify functional equivalence for LTE/WiMAX operations before substitution.
