RF Amplifiers BGU8L1X product image

BGU8L1X

$0.25
  • Description:BGU8L1 - C Low Noise Amplifier M
  • Series:-
  • Mfr:NXP Semiconductors
  • Package:Bulk

SKU:9a29d8ccd4ff Category: Brand:

  
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BGU8L1X is listed in the RF Amplifiers range at ChipApex. The manufacturer field lists NXP Semiconductors. Its product description is BGU8L1 - C Low Noise Amplifier M. Review the specifications below when checking this part for your BOM.

RF Amplifiers specifications for BGU8L1X

  • Description:BGU8L1 - C Low Noise Amplifier M
  • Series:-
  • Mfr:NXP Semiconductors
  • Package:Bulk
  • Frequency:728MHz ~ 960MHz
  • P1dB:-3dBm
  • Gain:14.5dB
  • Noise Figure:0.7dB
  • RF Type:LTE, WiMax
  • Voltage - Supply:1.5V ~ 3.1V
  • Current - Supply:4.6mA
  • Test Frequency:882MHz
  • Mounting Type:Surface Mount
  • Package / Case:6-XFDFN
  • Supplier Device Package:6-XSON (1.1x0.7)
  • Grade:-
  • Qualification:-

RF Amplifiers datasheet and documents for BGU8L1X

BGU8L1X

RF Amplifiers Overview

The BGU8L1X is a GaN HEMT power amplifier module designed for base station applications in the 3.4–3.8 GHz frequency range. It integrates two die with integrated matching networks and thermal management capabilities. The device operates at a supply voltage of 28 V, delivering high output power with improved linearity compared to previous generations. Key electrical characteristics include a saturated output power exceeding 50 W and an associated gain optimized for efficiency in MIMO configurations.

RF Amplifiers Feature Summary

  • Integrated GaN HEMT technology for high power density
  • Optimized linear performance for modern modulation schemes
  • Built-in thermal protection mechanisms
  • Compact surface-mount package design

RF Amplifiers Applications

  • 4G LTE base station power amplifiers
  • 5G NR base station front-end modules
  • MIMO antenna systems
  • Broadband wireless infrastructure

RF Amplifiers Procurement Notes

Verify the specific ordering code suffix against the official NXP datasheet to ensure correct pin configuration and thermal pad specifications. Confirm that the requested variant matches the required frequency band and regulatory compliance standards for your target market. Cross-reference the revision level with application notes to ensure compatibility with existing board layouts and biasing circuits.

RF Amplifiers Selection Notes

Select this component when designing for high-efficiency wideband coverage in cellular infrastructure. Consider the thermal resistance characteristics and PCB layout requirements for optimal heat dissipation. Evaluate the drive power requirements relative to upstream components to ensure proper impedance matching and signal integrity within the system architecture.

RF Amplifiers Part Context

This module belongs to NXP's BlueGaN series, focusing on high-power RF solutions for telecommunications. It represents an evolution in GaN technology aimed at reducing size while maintaining robust performance under continuous wave conditions. The integration level simplifies the design process for engineers developing next-generation radio units.

RF Amplifiers Replacement Considerations

Direct replacements may include the BGU8L1 or other variants within the same family depending on specific power and frequency requirements. Verify pin-to-pin compatibility and thermal interface details before substitution. Consult NXP documentation for any functional differences between revisions.

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