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BHWM257-EVB is listed in the RF Front End (LNA + PA) range at ChipApex. The manufacturer field lists BHW Technologies. Its product description is EVB RF IC FEM ISM 2.4GHZ 2X2 DFN. Review the specifications below when checking this part for your BOM.
The BHWM257-EVB is an evaluation board for the BHWM257 RF front-end module, designed for 2.4 GHz to 2.5 GHz ISM band applications. It integrates a Low Noise Amplifier (LNA) and Power Amplifier (PA) to support IEEE 802.15.4, Bluetooth, and Zigbee protocols. The underlying component utilizes an 8-DFN (2x2 mm) package. Key electrical specifications include a maximum operating frequency of 2.5 GHz and a minimum frequency of 2.4 GHz. The PA delivers 13 dBm output power with a corresponding current consumption of 22 mA at this power level.
Verify that the specific order corresponds to the BHWM257-EVB evaluation kit rather than the standalone BHWM257 component. Confirm that the package includes necessary accessories such as USB cables and antennas if required for immediate testing. Ensure compatibility with the target host microcontroller or SoC before deployment.
Select this evaluation board when validating the performance of the BHWM257 module in a complete system context. It is suitable for engineers requiring a reference design to assess signal integrity, power consumption, and range capabilities for 2.4 GHz IoT devices prior to final PCB layout.
This evaluation board serves as a development tool for the BHWM257, an RF front-end IC manufactured by BHW Technologies. The BHWM257 itself is a discrete component housed in an 8-DFN package, intended for integration into compact wireless modules. The EVB facilitates rapid prototyping and characterization of the amplifier's gain, noise figure, and linearity characteristics.
No public confirmed substitute part numbers are available for this specific evaluation kit. For component-level replacement, consult official cross-reference data for the BHWM257 IC.
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