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BR82 is listed in the Bridge Rectifier range at ChipApex. The manufacturer field lists GeneSiC Semiconductor. Its product description is BRIDGE RECT 1PHASE 200V 8A BR-8. Review the specifications below when checking this part for your BOM.
The GeneSiC Semiconductor BR82 is a single-phase silicon bridge rectifier housed in the BR-8 package. It supports a repetitive peak reverse voltage (VRRM) of 200 V, with corresponding RMS and DC blocking voltages of 140 V and 200 V, respectively. The device delivers a maximum average forward rectified current (IO) of 8.0 A at a case temperature of 50 °C. It withstands a peak forward surge current (IFSM) of 250 A under half-sine wave conditions. Key electrical parameters include a maximum instantaneous forward voltage drop (VF) of 1.1 V per bridge element at 4.0 A, and a maximum DC reverse current (IR) of 10 μA at rated voltage and 25 °C.
Verify the specific part number against official manufacturer documentation to confirm exact ratings and package dimensions. Ensure compatibility with existing thermal management solutions, as the 8.0 A rating is specified at a case temperature of 50 °C. Confirm that the BR-8 package mounting style aligns with the mechanical design requirements of the target assembly.
Select this component when a 200 V reverse voltage rating and 8 A continuous current capability are required in a through-hole configuration. Consider the 1.1 V forward voltage drop for power loss calculations at the expected operating current. Verify that the 250 A surge current rating meets the inrush requirements of the specific circuit application.
The BR82 belongs to the BR805 thru BR84 series of single-phase silicon bridge rectifiers from GeneSiC Semiconductor. This family utilizes the BR-8 molded plastic package designed for through-hole mounting via #6 screw holes. The series covers voltage ratings from 50 V to 400 V while maintaining an 8.0 A current capacity across all variants.
Direct replacements must match the 200 V VRRM, 8.0 A IO, and BR-8 package footprint. Verify pinout compatibility and thermal resistance characteristics before substitution.
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