BSM200GA170DLCHOSA1

Overview

The BSM200GA170DLCHOSA1 is a dual IGBT silicon module manufactured by Infineon Technologies. It features a collector-emitter maximum voltage (VCEO) of 1.7 kV and a continuous collector current rating of 400 A at 25°C. The device exhibits a collector-emitter saturation voltage of 2.6 V and a power dissipation capacity of 1920 W. Designed for screw mount installation, it operates within a temperature range of -40°C to +125°C. The module utilizes a 62 mm package configuration.

Feature Summary

• Dual IGBT configuration for high-power switching applications
• High thermal stability with wide operating temperature range
• Robust mechanical design suitable for screw mounting

Applications

• Industrial motor drives
• Uninterruptible power supplies (UPS)
• Induction heating systems

Procurement Notes

Verify component authenticity through official Infineon channels or authorized distributors. Confirm the specific suffix HOSA1 matches project requirements as it may indicate specific qualification or packaging variations. Check current lifecycle status as industrial modules may undergo discontinuation notices. Ensure compatibility with existing gate driver circuits and thermal management solutions before procurement.

Selection Notes

Select this module when applications require high current handling capabilities exceeding standard single IGBT limits. The 1.7 kV rating suits medium-voltage industrial systems. Evaluate thermal resistance parameters against heatsink capabilities to ensure junction temperatures remain within safe operating areas during peak load conditions. Consider the dual configuration benefits for half-bridge topologies in power conversion stages.

Part Context

This component belongs to Infineon's BSM series of IGBT modules, designed for robust industrial power electronics. The GA designation typically indicates specific trench technology generation. The DLC suffix denotes the specific package type and terminal configuration. This series supports high-efficiency power conversion in demanding environments requiring reliable semiconductor switching performance.

Replacement Considerations

Direct replacements include the BSM100GB170DLC for lower current requirements or the BSM200GB170DLC for alternative package variants. Verify pinout compatibility and thermal characteristics when substituting. Consult Infineon documentation for updated equivalents if the specific HOSA1 suffix variant is discontinued.