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Product Detailed Parameters
- Description：BSM300GA160 - INSULATED GATE BIP
- Series：*
- Mfr：Infineon Technologies
- Package：Bulk
- IGBT Type：-
- Voltage - Collector Emitter Breakdown (Max)：-
- Current - Collector (Ic) (Max)：-
- Current - Collector Pulsed (Icm)：-
- Vce(on) (Max) @ Vge, Ic：-
- Power - Max：-
- Switching Energy：-
- Input Type：-
- Gate Charge：-
- Td (on/off) @ 25°C：-
- Test Condition：-
- Reverse Recovery Time (trr)：-
- Operating Temperature：-
- Mounting Type：-
- Package / Case：-
- Supplier Device Package：-
- Grade：-
- Qualification：-
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Overview
The BSM300GA160DN13CB7HOSA1 is a 1.6 kV, 300 A single IGBT module from Infineon's PrimePACK™ 3 family. It features an NPT (Non-Punch Through) IGBT4 chip technology with anti-parallel diode. The device utilizes a copper-clad direct-bonded copper substrate for enhanced thermal performance and low inductance design. Key electrical parameters include a maximum collector-emitter voltage of 1600 V, continuous collector current of 300 A, and typical on-state voltage of 2.55 V at rated conditions.
Feature Summary
- High power density design utilizing advanced NPT IGBT4 technology
- Low thermal resistance via direct bonded copper substrate
- Optimized for high switching frequency applications
- Robust short-circuit withstand capability
Applications
- Industrial motor drives
- Uninterruptible power supplies
- Induction heating systems
- Welding inverters
Procurement Notes
Verify the complete part number including suffixes against official Infineon documentation to ensure correct configuration. Confirm that the specific ordering code matches the required package variant and terminal plating specifications. Cross-reference the datasheet revision date to ensure compatibility with current design standards and safety certifications.
Selection Notes
Select this component based on voltage and current requirements exceeding standard 1200 V modules. Evaluate thermal management solutions compatible with the PrimePACK™ 3 footprint. Ensure gate driver capabilities match the switching characteristics of the IGBT4 technology. Consider system inductance constraints to leverage the module's low stray inductance design effectively.
Part Context
This module belongs to Infineon's PrimePACK™ 3 series, designed for high-power industrial applications. It represents a generation of modules offering improved efficiency and power density compared to previous iterations. The series is widely recognized for reliability in demanding environments requiring robust power conversion.
Replacement Considerations
Direct replacements within the same PrimePACK™ 3 family should be verified for pin-to-pin compatibility and identical electrical ratings. Upgrades may require re-evaluation of thermal interface materials and gate drive circuits due to potential differences in switching speed and charge requirements.
