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The BSM300GA170DLCHOSA1 is a single IGBT module manufactured by Infineon Technologies, designed for high-power industrial applications. It features a maximum collector-emitter voltage of 1700 V and a continuous collector current of 600 A at 25°C. The module delivers a power dissipation capacity of 2520 W and utilizes screw mount chassis mounting. It operates within a temperature range of -40°C to +125°C and employs silicon technology.
Verify the complete part number including the HOSA1 suffix against official Infineon documentation to ensure correct configuration. Confirm availability status as distribution channels may vary. Check for specific environmental compliance certifications required for your region before finalizing procurement orders.
Select this module when applications require high voltage blocking and substantial current capacity in a single package. Ensure the cooling system can handle the specified 2520 W dissipation. Verify that the mechanical footprint matches the chassis design constraints and that gate drive signals are compatible with standard IGBT requirements.
This component belongs to Infineon's BSM series of IGBT modules, which are engineered for demanding power electronics applications. The series offers various current ratings and voltage classes to suit different power levels. The BSM300 variant specifically targets high-power scenarios requiring reliable switching performance.
Consult official Infineon substitution guides for direct replacements. Cross-reference electrical parameters such as Vceo, Ic, and package dimensions to ensure compatibility with existing designs.