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Product Detailed Parameters
- Description：IGBT MOD 600V 375A 1250W
- Series：-
- Mfr：Infineon Technologies
- Package：Tray
- IGBT Type：-
- Configuration：2 Independent
- Vce(on) (Max) @ Vge, Ic：2.45V @ 15V, 300A
- Input：Standard
- NTC Thermistor：No
- Operating Temperature：-40°C ~ 125°C
- Mounting Type：Chassis Mount
- Package / Case：Module
- Supplier Device Package：Module
- Voltage - Collector Emitter Breakdown (Max)：600 V
- Current - Collector (Ic) (Max)：375 A
- Power - Max：1250 W
- Current - Collector Cutoff (Max)：1 mA
- Input Capacitance (Cies) @ Vce：13 nF @ 25 V
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Overview
The BSM300GB60DLCHOSA1 is a high-power IGBT module from Infineon Technologies, belonging to the EconoPACK™ 2B series. It features a dual IGBT configuration with an integrated anti-parallel diode in a single package. The device supports a collector-emitter voltage (Vces) of 600 V and a nominal collector current (Ic) of 300 A at 25°C. Key electrical parameters include a typical saturation voltage (Vce(sat)) of approximately 1.95 V and a forward voltage (Vf) of about 1.45 V for the diode. The module utilizes TRENCHSTOP™ technology for optimized switching performance and thermal efficiency.
Feature Summary
- EconoPACK™ 2B packaging provides a flexible pin grid system suitable for custom layouts and diverse power electronics designs.
- TRENCHSTOP™ IGBT technology ensures low conduction losses and robust switching characteristics.
- Integrated NTC thermistor enables precise temperature monitoring for reliable thermal management.
Applications
- Industrial motor drives and servo systems
- Uninterruptible power supplies (UPS)
- High-frequency welding inverters
Procurement Notes
Verify the complete part number including suffixes such as HOSA1 against official Infineon documentation to ensure correct revision and material compliance. Confirm availability through authorized distributors as lead times may vary. Request the latest datasheet and application notes for proper handling and mounting instructions prior to procurement.
Selection Notes
Select this module for applications requiring high current density and efficient thermal dissipation in compact spaces. Ensure the gate drive circuitry matches the specified gate charge and threshold voltages. Verify that the cooling solution can handle the specified power dissipation at the intended operating junction temperature.
Part Context
This component is part of Infineon's EconoPACK™ 2B family, designed for medium to high power applications. It succeeds earlier EconoPACK variants by offering improved pin flexibility and thermal performance. The BSM300GB60DLC series is widely used in industrial power conversion where reliability and power density are critical.
Replacement Considerations
Direct replacements within the same series include BSM300GB60DN2 or BSM300GB60DLC. Verify pin compatibility and thermal resistance specifications before substitution. Cross-referencing with newer generations like EconoPACK™ 3 requires careful evaluation of mechanical and electrical differences.
