BSM30GP60B2BOSA1

BSM30GP60B2BOSA1

  • Description:IGBT MODULE 600V 50A 180W
  • Series:-

SKU:75f095df72e5 Category: Brand:

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Product Detailed Parameters

  • Description:IGBT MODULE 600V 50A 180W
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Tray
  • IGBT Type:-
  • Configuration:Full Bridge
  • Vce(on) (Max) @ Vge, Ic:2.45V @ 15V, 30A
  • Input:Three Phase Bridge Rectifier
  • NTC Thermistor:Yes
  • Operating Temperature:-40°C ~ 125°C
  • Mounting Type:Chassis Mount
  • Package / Case:Module
  • Supplier Device Package:Module
  • Voltage - Collector Emitter Breakdown (Max):600 V
  • Current - Collector (Ic) (Max):50 A
  • Power - Max:180 W
  • Current - Collector Cutoff (Max):500 µA
  • Input Capacitance (Cies) @ Vce:1.6 nF @ 25 V

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BSM30GP60B2BOSA1

Overview

The BSM30GP60B2BOSA1 is a three-phase inverter module from Infineon's GP60 series, designed for industrial motor control and power conversion. It integrates six IGBTs with anti-parallel diodes in a single package. The device features a collector-emitter voltage of 600 V and a nominal collector current of 30 A at 25°C. It utilizes TRENCHSTOP™ technology to optimize switching performance and conduction losses. The module employs an isolated base plate for efficient thermal management and mechanical mounting.

Feature Summary

  • Integrates a complete three-phase inverter bridge within a compact insulated module.
  • Utilizes TRENCHSTOP™ IGBT technology to balance low conduction voltage drop with controlled switching speeds.
  • Features an electrically isolated copper base plate to facilitate direct heatsink attachment and improve thermal dissipation.

Applications

  • Industrial servo drives and AC motor controllers
  • Uninterruptible power supplies (UPS) and inverters
  • Induction heating systems

Procurement Notes

Verify the specific suffix B2BOSA1 against official datasheets to confirm pinout compatibility and RoHS status. Ensure the ordering code matches the exact revision required for your design. Cross-reference with Infineon's official distribution channels to avoid counterfeit components. Confirm that the thermal interface material selection aligns with the module's base plate specifications.

Selection Notes

Select this component for applications requiring moderate power density and reliable three-phase inversion. Evaluate the thermal resistance characteristics against your heatsink design to ensure junction temperatures remain within safe operating limits. Consider the gate charge requirements when designing the driver circuitry to achieve optimal switching efficiency without excessive electromagnetic interference.

Part Context

This part belongs to Infineon's GP60 series of IGBT modules, which are engineered for general-purpose industrial applications. The series offers a balance between cost-effectiveness and performance, utilizing mature trench technology. It serves as a standard solution for replacing older discrete designs or previous generation modules in motor drive and power supply architectures.

Replacement Considerations

Direct replacements include other GP60 series variants such as BSM30GP60 or BSM30GP60DL, provided pinouts and electrical ratings match. Verify that any substitute maintains the same package dimensions and thermal characteristics to fit existing mechanical constraints.

BSM30GP60B2BOSA1BSM30GP60B2BOSA1

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