BSM35GP120BOSA1

Overview

The BSM35GP120BOSA1 is a three-phase IGBT module from Infineon Technologies, utilizing the EconoPIM package. It integrates a rectifier diode, an inverter stage with IGBT and freewheeling diode, and a brake-chopper circuit. Key electrical ratings include a collector-emitter voltage of 1200 V for both inverter and brake-chopper transistors, and a repetitive peak reverse voltage of 1600 V for the rectifier diode. The nominal DC collector current is 35 A at Tc=80°C for the inverter and 17.5 A for the brake-chopper. Total power dissipation is rated at 230 W (TC=25°C) for the inverter and 180 W for the brake-chopper. The module features an integrated NTC thermistor with a rated resistance of 5 kΩ at 25°C.

Feature Summary

• Integrated three-phase topology combining rectifier, inverter, and brake-chopper functions within a single compact housing.
• Includes an internal NTC thermistor for precise thermal monitoring and protection.
• Designed for robust operation with high surge current capabilities and defined short-circuit withstand times.

Applications

• Three-phase motor drives and variable frequency drives
• Induction heating systems
• Uninterruptible power supplies (UPS)
• Industrial welding equipment

Procurement Notes

Verify component authenticity through authorized distribution channels to ensure compliance with original manufacturer specifications. Confirm that the ordering suffix matches the required technical variant, as suffixes may indicate specific testing or packaging differences. Request the latest datasheet directly from the supplier to validate current production status and any potential design changes prior to final procurement decisions.

Selection Notes

Select this module based on the 1200 V blocking voltage requirement and the specific current ratings for each bridge leg. Ensure the cooling system can handle the total power dissipation of 230 W for the inverter section. Verify that the gate drive voltage aligns with the specified ±15 V operating range. Consider the stray inductance limits when designing the PCB layout to minimize switching overvoltages.

Part Context

This component belongs to the BSM series of Power Integration Modules (PIM). These modules are engineered to reduce parasitic inductances by integrating multiple semiconductor chips into a single unit. The EconoPIM form factor provides a standardized footprint suitable for high-power density applications requiring combined rectification and inversion capabilities.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. When evaluating alternatives, match the pinout configuration, mechanical dimensions, and electrical ratings precisely. Consult the manufacturer for updated product line recommendations if discontinuation is suspected.